tag: Fraunhofer IIS EAS

Confusion Grows Over Packaging And Scaling
By Ann Mutschler - 15 Oct, 2020 - Comments: 0

The push toward both multi-chip packaging and continued scaling of digital logic is creating confusion about how to classify designs, what design tools work best, and how to best improve productivity and meet design objectives. While the goals of design teams remains the same — better performance, lower power, lower cost — the choices often involve tradeoffs between design budgets and ho... » read more

13-Gb/s Transmitter For Bunch Of Wires Chip-To-Chip Interface Standard
By Fraunhofer IIS/EAS - 14 Oct, 2020 - Comments: 0

Continuous downscaling of integrated circuits has reached a bottleneck. Technologies such as system in a package, multi-chip module and integration of chips on an active or passive interposer can further improve the system performance. Bunch of wires interface standard was recently introduced for chip to chip short interfaces within a package. This standard required both terminated and untermin... » read more

Analog Chip Layout: Creativity Vs. Deadlines
By Benjamin Prautsch - 10 Sep, 2020 - Comments: 0

The entire design of integrated circuits, from the specification onward, depends on successful validation by measurement of microchips. One key milestone in this process is the completion of the layout. However, the path to reach this point can be quite difficult as many iterations are usually required. It includes: Iterations with the customer to finalize the specification. Iteratio... » read more

Dealing With Device Aging At Advanced Nodes
By Ann Mutschler - 10 Sep, 2020 - Comments: 0

Premature aging of circuits is becoming troublesome at advanced nodes, where it increasingly is complicated by new market demands, more stress from heat, and tighter tolerances due to increased density and thinner dielectrics. In the past, aging and stress largely were separate challenges. Those lines are starting to blur for a number of reasons. Among them: In automotive, advanced-node... » read more

A Summary Of Piezoelectric Energy Harvesting For Autonomous Smart Structures
By Fraunhofer IIS/EAS - 09 Sep, 2020 - Comments: 0

The technology of energy harvesting has great potential to enable energy autonomy of wireless sensors. The drop of power requirements of micro-electronic devices allows confidence that piezoelectric energy harvesting (PEH) is able to reliably power a wireless sensor network (WSN). The present work summarizes results of ongoing research in the field of PEH. With the aid of a performance metric a... » read more

Mission Profiles In The Automotive Development Process
By Christoph Sohrmann - 13 Aug, 2020 - Comments: 0

The automotive industry's roadmap for the coming years is e-mobility and autonomous driving. Its implementation is likely to bring about changes on a par with the invention of the automobile itself. While the motor vehicle used to be primarily a mechanical product, it is now an entirely electronic system. Many of the new functions increase the safety of the driver and other road users, and t... » read more

Redefining The Power Delivery Network
By Brian Bailey - 13 Aug, 2020 - Comments: 3

Reliably getting power around a package containing multiple dies, potentially coming from multiple sources, or implemented in diverse technologies, is becoming much more difficult. The tools and needed to do this in an optimized manner are not all there today. Nevertheless, the industry is confident that we can get there. For a single die, the problem has evolved slowly over time. "For a ... » read more

Preparing For A Barrage Of Physical Effects
By Ann Mutschler - 13 Aug, 2020 - Comments: 0

Advancements in 3D transistors and packaging continue to enable better power and performance in a given footprint, but they also require more attention to physical effects stemming from both increased density and vertical stacking. Even in planar chips developed at 3nm, it will be more difficult to build both thin and thick oxide devices, which will have an impact on everything from power to... » read more

A 10.5 μW Programmable SAR ADC Frontend With SC Preamplifier For Low-Power IoT Sensor Nodes
By Fraunhofer IIS/EAS - 12 Aug, 2020 - Comments: 0

Massive deployment of wireless autonomous sensor nodes requires their lifetime extension and cost reduction. The analog frontend (AFE) plays a key role in this context. This paper presents a successive approximation register analog-to-digital converter (SAR ADC) with a switched-capacitor programmable gain switched preamplifier (SC PGSA), as a basic component of an integrated ultra-low power AFE... » read more

Better Analytics Needed For Assembly
By Anne Meixner - 11 Aug, 2020 - Comments: 0

Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

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