tag: Fraunhofer IIS EAS

What Exactly Is Multi-Physics?
By Brian Bailey - 13 Feb, 2025 - Comments: 1

Multi-physics is the new buzzword in semiconductor design and analysis, but the fuzziness of the term is a reflection of just how many new and existing problems need to be addressed simultaneously in the design flow with advanced nodes and packaging. This disaggregation of planar SoCs and the inclusion of more processing elements, memories, interconnects, and passives inside a package has cr... » read more

Chip Architectures Becoming Much More Complex With Chiplets
By Ed Sperling and Ann Mutschler - 30 Jan, 2025 - Comments: 0

The migration from monolithic SoCs to chiplet-based designs is creating a confusing array of options and tradeoffs for design teams working at the leading edge, and the number of choices is only going to increase as third-party chiplets begin pouring into the market. That hasn't dampened the appetite for chiplets, however, which are deemed essential for future generations of semiconductors f... » read more

Advanced Packaging: A Curse Or A Blessing For Trustworthiness?
By Andy Heinig - 16 Jan, 2025 - Comments: 0

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and critical infrastructure. These sectors depend on electronic systems that are not only powerful but also absolutely reliable and, above all, secure. This represents a major challenge, as the increasing co... » read more

Strain, Stress In Advanced Packages Drives New Design Approaches
By Ann Mutschler - 19 Dec, 2024 - Comments: 2

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools. Unlike in the past, when various components were crammed into a planar SoC on a relatively thick substrate, the new substrates are bei... » read more

Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions
By Andy Heinig - 12 Dec, 2024 - Comments: 0

Chiplets offer great potential for the automotive and industrial sectors, especially as these applications often have high performance requirements but are needed only in small quantities. The modular principle behind chiplets enables efficient design and production: individual components have to be produced only once and can then be flexibly combined to create tailored solutions. This offers m... » read more

Where Is The Software For Shift Left?
By Brian Bailey - 12 Dec, 2024 - Comments: 0

Co-development of hardware and software has been a dream for a long time, but significant hurdles remain. Neither domain is ready with what the other requires at the appropriate time. The earlier something can be done in a development flow, the less likely problems will be found when they are more difficult or expensive to fix. It may require both tool and methodology changes, so that a proc... » read more

Chiplets for Future Automotive Application
By Fraunhofer IIS/EAS - 13 Nov, 2024 - Comments: 0

Abstract Autonomous vehicles and associated ADAS systems are driving vehicle electronics content to unprecedented levels. These systems require significant processing power via a centralized system. Chiplets are one solution to distribute functionality on different technologies and can help to secure the supply chain and reduce rising development costs in advanced IC nodes. This traditionally ... » read more

Green ICT: The IoT World Also Needs Ecological Awareness
By Volkhard Beyer - 17 Oct, 2024 - Comments: 0

By Volkhard Beyer and Dirk Mayer Microelectronics support the fight against climate change and for a better environment; for example, by intelligently controlling drive units, ensuring optimal operation of energy systems, and monitoring the resource requirements of production processes. Unfortunately, however, the ICT sector itself is one of the fastest-growing emitters of greenhouse gase... » read more

Pressure Builds To Adopt Virtual Prototypes
By Brian Bailey - 26 Sep, 2024 - Comments: 0

Virtual prototypes, often used as a niche tool in the past, are becoming essential for developing complex systems. In fact, systems companies are finding they no longer can function without them. In the semiconductor industry, a virtual prototype is a model for a system at an abstraction level above RTL. But there is no such thing as 'the' virtual prototype. They are constructed for a partic... » read more

eFuses: Use Cases, Benefits, And Design In The System Context
By Jens Michael Warmuth - 12 Sep, 2024 - Comments: 0

In recent years, the automotive industry has been one of the drivers of innovation in the field of electrical and electronic system safety. This is primarily due to the rapid uptake and, in some cases, already mandatory use of advanced driver assistance systems (ADAS) as well as to the first steps toward (partially) autonomous vehicles. In conventional safety systems, the off state can be as... » read more

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