tag: Fraunhofer IIS

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 13 May, 2022 - Comments: 0

Automotive, mobility Fraunhofer IIS has opened a five-kilometer (3.11-mile) 5G test bed for automotive 5G applications near the city of Rosenheim in Bavaria, Germany. A closed 5G network with multiple base stations covers the test track, where connected cars can be tested under real conditions. “The automotive test bed is designed specially for developers and users that want to test new conn... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 25 Mar, 2022 - Comments: 0

Automotive Suzuki will collaborate with SkyDrive on flying cars. SkyDrive is working on an air taxi service that it wants to launch at the 2025 World Exposition in Osaka, Japan. Recalls: The car company Tesla is recalling 947 vehicles in the United States because rearview image lags and does not display immediately when the car is put into reverse, said the National Highway Traffic Safety A... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Mar, 2022 - Comments: 0

From pandemic to war — some of the news this week highlights reactions to Russia’s invasion of Ukraine. Pervasive computing, IoT, 5G and beyond SpaceX sent Starlink satellite dishes to Ukraine to enable Ukrainian access to the Internet. The caveat is the uplink signals from satellite equipment can be used to triangulate the position of the dish, which can then be hit by missile. The dis... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 25 Feb, 2022 - Comments: 0

Security Fraunhofer IIS received a grant to establish an R&D center for trustworthy integrated electronic systems for security and safety. Working with other Fraunhofer divisions, Fraunhofer IIS will use innovative methods in design and testing to help protect IP along the value chain of microelectronic components and systems. The center will focus on creating a secure design flow for inte... » read more

Week In Review: Design, Low Power
By Jesse Allen - 03 Dec, 2021 - Comments: 0

Infineon Technologies acquired Syntronixs Asia, which specializes in precision electroplating, a key process in the assembly process of semiconductors. Syntronixs Asia has a workforce of more than 500 people and has been a major service provider for Infineon since 2009. “Through this acquisition, we have made another important step to strengthen the resilience of our supply chain,” said Tho... » read more

Condition Monitoring Of Drive Trains By Data Fusion Of Acoustic Emission And Vibration Sensors
By Fraunhofer IIS/EAS - 13 Aug, 2021 - Comments: 0

Early damage detection and classification by condition monitoring systems is crucial to enable predictive maintenance of manufacturing systems and industrial facilities. The data analysis can be improved by applying machine learning algorithms and fusion of data from heterogenous sensors. This paper presents an approach for a step-wise integration of classifications gained from vibration and ac... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Jul, 2021 - Comments: 0

Security Xilinx is investing an undisclosed amount in fabless semiconductor startup Kameleon Security, which is working on a cyber protection chip for servers, data centers, and cloud computing. The proactive Security Processing Unit (ProSPU) already secures the boot and has a root of trust (RoT). The chip will be demonstrated at the Open Compute Project (OCP) Global Summit, which is planned f... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 May, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Foxconn (also known as Hon Hai Technology Group) is forming a joint venture (JV) with Yageo Group, a component production and process management company for EVs and other high-end electronics, to focus on the development of semiconductors under $2 USD, which they call “small ICs.” Through the JV, a new company called XSemi wil... » read more

Steep Spike For Chip Complexity And Unknowns
By Ed Sperling - 05 May, 2021 - Comments: 0

Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

Car Industry Changing Under The Hood
By Ann Mutschler - 07 Jan, 2021 - Comments: 0

After an initial burst of autonomous activity, the automotive ecosystem regrouped, re-evaluated its goals, and is now ready to begin deploying new technologies made possible by modern development approaches and forward-looking vehicle architectures. The pandemic hurt vehicle sales in 2020, but it also gave the OEMs a chance to catch their breath. Panic over announcements from other carmakers... » read more

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