Week In Review: Auto, Security, Pervasive Computing

CISA smart city security guidance; Infineon LPDDR flash for automotive; high-accuracy positioning in private 5G network for industrial.


Pervasive computing

Broadcom announced delivery of its Jericho3-AI fabric for artificial intelligence (AI) networks, which delivers 26 petabits per second of Ethernet bandwidth. That is roughly four times the bandwidth of the previous generation, at a 40% power savings per gigabit.

AMD released the Ryzen Embedded 5000 Series processors for customers requiring power-efficient processors optimized for “always on” networking firewalls, network-attached storage systems and other security applications.

Texas Instruments introduced a new family of Wi-Fi 6 companion ICs for IoT devices  enabling reliable, secure and efficient Wi-Fi connections for applications that operate in high-density or high-temperature environments up to 105°C.

Fraunhofer-Institute for Integrated Circuits IIS is working with Intel to improve 5G positioning. Using private 5G radio access networks (RANs) based on Intel FlexRAN software, Fraunhofer IIS is researching how to deliver high accuracy positioning the private 5G network in industrial settings. Examples of use cases are asset tracking or man-machine/robot collaboration where precise position information is needed. Fraunhofer says that sub-meter accuracy is achieved with distributed antennas and the multi-lateration of uplink measurements that enable UL-TDOA-based positioning (Uplink Time Difference of Arrival). “We use commercial smartphones as well as industrial 5G modems to demonstrate how sub-meter accuracy in an industrial indoor environment with racks, machines, walls and many moving objects can be realized,” said Thomas von der Gruen, head of the department for Precise Positioning and Analytics in a release. “In our 5G Bavaria Industry 4.0 Test Bed we successfully evaluated and combined our uplink TDOA and Intel FlexRAN.”

Chinese-based developer of programmable FPGA cores Hercules Microelectronics (HME), integrated Mixel’s MIPI C-PHY/D-PHY IP into the HME-H3 FPGA, which is now in mass production.

A lithography type used since the 1990s, nanoimprint lithography (NIL) has a lot of benefits for the manufacturing photonic chips. NIL is finding use in photonics, biotech, and other markets. Here’s what you need to know.

Cadence announced its new Virtuoso Studio, a design tool for custom analog, custom, and RFIC design, including tools for advanced mmWave design. It handles 3D-IC integration, allowing the heterogeneous integration of 2.5D and 3D designs for advanced nodes, analog/RF packaging/modules, and photonics systems. The cloud-ready studio offers interactive signoff quality analysis during layout creation. Of course, the studio connects and plays well with to other Cadence tools.

Rambus launched a 24 Gb/s GDDR6 PHY, a high-bandwidth, low-latency memory interface targeting AI/ML, graphics, and networking applications. It has a memory interface subsystem that uses Rambus’ GDDR6 Controller IP.

Design teams can now access Cadence Pegasus Verification System and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform.

Cadence also demonstrated that its LPDDR5X memory interface IP and SK hynix’s LPDDR5T (Turbo) mobile DRAM can operate together at speeds greater than the LPDDR5X standard and they work together well. “SK hynix’s LPDDR5 Turbo mobile DRAM opens up new possibilities beyond smartphones, to AI, machine learning and augmented/virtual reality,” said Sungsoo Ryu, vice president of DRAM product planning at SK hynix, in a release. “Proving interoperability with Cadence’s memory interface IP is a key step in enabling customers targeting 9600Mbps operation.”

proteanTecs joined the IOWN Global Forum, a forum founded in 2020 by Nippon Telegraph and Telephone Corporation (NTT), Intel, and Sony to improve communications infrastructure.

Automotive, mobility

Infineon launched the industry’s first LPDDR Flash memory to enable next-generation automotive E/E architectures. The Infineon SEMPER X1 LPDDR Flash offers safe, reliable and real-time code execution critical for automotive domain and zone controllers. Infineon says the device delivers 8x the performance of current NOR Flash memories and achieves 20x faster random read transactions for real-time applications, enabling software-defined vehicles to deliver advanced features with enhanced safety and architectural flexibility.

Keysight added a compact, aka Novus mini tester to its Keysight Novus Portfolio for network engineers to have a hand-held way to perform time-sensitive networking compliance testing for automotive and industrial internet of things (IIoT) applications. Time-sensitive networks (TSNs) are used in automotive systems. Keysight says the mini validates layers 2-3, which means it covers full performance and conformance testing.

Ansys has uncorked its Ansys Developer portal with the goal of making its tools more accessible for developers.

How useful AI/ML will be in semiconductor design? See what the experts at the table think, from the checks and balances to the unknowns.

GM has invested in the U.S.-based lithium supply by leading a $50 million funding round in EnergyX. EnergyX has direct lithium extraction (DLE) technology that can pull lithium from a brine in an anode-ready form.

Stellantis is testing out if older European models of internal combustion engine (ICE) vehicles can run on eFuel as a replacement for the gasoline. The company is testing 28 engine families and reports that the eFuel can reduce up to 90% of a vehicle’s CO2 emissions.


Last week was all about secure by design guidance. This week, the U.S. Cybersecurity & Infrastructure Security Agency (CISA), the National Security Agency (NSA), the Federal Bureau of Investigation (FBI), the United Kingdom National Cyber Security Centre (NCSC-UK), the Australian Cybersecurity Centre (ACSC), the Canadian Centre for Cyber Security (CCCS), and the New Zealand National Cyber Security Centre (NCSC-NZ) released Cybersecurity Best Practices for Smart Cities, guidance for designing cybersecurity protection into smart cities. The report outlines the risks and help and training for cities to strengthen their cyber posture, security planning, and resilience if an attack happens.


Recent automotive technical papers:

Click here for more automotive research.

Recent AI/ML/DL

Click here for more AI/ML/DL research.
Recent security technical papers:

Click here for more security papers.

Upcoming Events

  • SPIE Optics + Optoelectronics 2023, April 24 – April 27
  • TSMC 2023 Technology Symposium, April 26
  • The Impact of New Regulations on the Semiconductor Design Ecosystem (hosted by ESD Alliance), April 26
  • ITF World 2023: Imec’s flagship event, May 16 – May 17
  • Women in Semiconductor: WIS 2023, May 1
  • International Memory Workshop, May 21 – May 24
  • Embedded Vision Summit, May 22 – May 24
  • RISC-V Summit Europe, June 5 – June 9


  • RSA Conference 2023, April 24 – April 27
  • IEEE International Symposium on Hardware Oriented Security and Trust (HOST), May 1 – May 4
  • IEEE Symposium on Security and Privacy, May 22 – May 25
  • io Security Trainings and Conference USA 2023, May 30 – June 3

See more events on our events page.

Further Reading:
Read the latest automotive, security, and pervasive computing articles, or check out the latest newsletter.

Leave a Reply

(Note: This name will be displayed publicly)