Failure Analysis Becoming Critical To Reliability


Failure analysis is rapidly becoming a complex, costly and increasingly time-consuming must-do task as demand rises for reliability across a growing range of devices used in markets ranging from automotive to 5G. From the beginning, failure analysis has been about finding out what went wrong in semiconductor design and manufacturing. Different approaches, tools and equipment have improved ov... » read more

Week In Review: Design, Low Power


Presto Engineering, an outsourced operations provider to semiconductor and IoT device manufacturers, acquired the DELTA Microelectronics business unit of FORCE Technology. The acquisition adds DELTA's ASIC design and manufacturing to its portfolio. The two companies will retain a strong relationship: FORCE Technology has become a shareholder of Presto Engineering and Juan Farré, FORCE’s CTO,... » read more

Power/Performance Bits: Jan. 28


Accelerator-on-chip Researchers at Stanford University and SLAC National Accelerator Laboratory created an electron-accelerator-on-chip. While the technique is much less powerful than standard particle accelerators, it can be much smaller. It relied upon an infrared laser to deliver, in less than a hair’s width, the sort of energy boost that takes microwaves many feet. The team carved ... » read more

Digital Twins In Automotive


The term “digital twin” refers to a new principle that is gaining importance in the development of complex hardware/software systems. In general, it refers to a virtual representation of the real system. This model serves to simulate the functional interactions of the parts, saving time and money by avoiding unnecessary redesign cycles and enabling considerably better optimization of the ov... » read more

Can Germany’s Auto Industry Keep Pace?


Germany's strength for the past half-century has been its automotive industry. The big question now is whether that also will become its biggest vulnerability. Challenged on all fronts by fundamental shifts in automotive technology, the German auto industry is struggling to transform itself from precision metal bending to advanced electronics, and so far its future in the face of competitors... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Virtual System Development Platforms For Safeguarding Complex Microelectronic Systems


Electronic systems are rapidly becoming more complex. This impacts almost all domains in which electronics are used today — especially industrial applications, medical engineering, communications engineering and, of course, automotive applications. What's changed is the addition of huge numbers of sensors and actuators that interact with the environment, the local integration of highly co... » read more

IoT For Building Energy Systems In Zero-Emission Buildings


By Dirk Mayer and Olaf Enge-Rosenblatt How can buildings contribute to a significant reduction in global primary energy consumption? Due to the global trend toward reducing CO2 emissions and resource conservation, the demands are increasing with regard to the efficiency of heating, ventilation and air-conditioning (HVAC) systems operated in buildings. In conflict with calls for fas... » read more

Blog Review: Oct. 2


In a video, Cadence's Tom Hackett explains finite element analysis by looking at a simple model of a bridge and showing why FEA techniques are required for analysis of real-world structures. Synopsys' Taylor Armerding examines why the 156-year-old False Claims Act has new relevance when companies are accused of failing to meet cybersecurity standards. Mentor's Colin Walls demystifies memo... » read more

Taking Energy Into Account


Considering power throughout the SoC design flow is common practice. The same cannot be said for energy, although that is beginning to change as chips increasingly incorporate heterogeneous processing elements. Combined with this, AI/ML/DL technologies increasingly allow engineering teams to explore and optimize design data for more targeted and efficient systems. But this approach also requ... » read more

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