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Failure Mechanism Detection Algorithm With MOSFET Body Diode


Autonomous driving is playing a big role in the automotive industry and defines the future of mobility on a big scale. However, autonomous driving faces several challenges, such as the performance of artificial intelligence and hardware reliability. To ensure safe functionality, the reliability of the electronic components plays an essential role and must be taken into consideration. One aspect... » read more

Chiplets: A Solution For The Shortage Of Chips


These days, there are new reports on the shortage of chips almost every day. Currently, this issue is affecting mainly car manufacturers such as Audi, Ford, and more. But other system manufacturers, such as in the machine construction industry, are also facing this challenge. Even manufacturers of mass-produced articles such as game consoles are reporting the same problems. The problem is sure ... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Infineon announced it has a Trusted Platform Module (TPM 2.0), called OPTIGA TPM 2.0, used to secure remote software updates, disc encryption, and user authentication on Linux-based systems. OPTIGA is an open software stack for securing comprehensive TSS* host software implementing the latest FAPI standard. Infineon developed the open-source software with Intel Corporation and Fraunho... » read more

Manufacturing Bits: March 2


Next-gen AFM At the recent SPIE Advanced Lithography conference, Imec, Infinitesima and others described a new metrology tool technology called a Rapid Probe Microscope (RPM). Infinitesima has shipped its first RPM 3D system, enabling three-dimensional (3D) metrology applications for leading-edge chips. The system was jointly developed with Imec. In the IEDM paper, Imec and Infinitesima... » read more

Design Support For A Green IoT


By Dirk Mayer and Roland Jancke The Internet of Things (IoT) is growing rapidly all around the world. New devices are continually being added, all collecting a variety of data and transmitting them (often wirelessly) to edge devices, which in turn relay the data to the cloud for further processing. It is estimated that in a few years IoT devices will be responsible for over 20% of global ene... » read more

Manufacturing Bits: Jan. 11


3D printing with liquids Martin Luther University Halle-Wittenberg (MLU) has developed a way to combine both materials and liquids in 3D printing applications. Researchers from MLU have developed liquid‐filled capsules using 3D printing technology. This in turn enables new medical agents to be incorporated into pharmaceutical products. It also allows liquids to be integrated into material... » read more

Top Tech Videos Of 2020


2020 shaped up to be a year of major upheaval, emerging markets and even increased demand in certain sectors. So it's not surprising that videos focusing on AI, balancing power and performance, designing and manufacturing at advanced nodes, advanced packaging, and automotive-related subjects were the most popular. Of the 68 videos published this year, the following were the most viewed in ea... » read more

Re-Architecting SerDes


Serializer/Deserializer (SerDes) circuits have been helping semiconductors move data around for years, but new process technologies are forcing it to adapt and change in unexpected ways. Traditionally implemented as an analog circuit, SerDes technology has been difficult to scale, while low voltages, variation, and noise are making it more difficult to yield sufficiently. So to remain releva... » read more

Functional Safety For Fail-Operational Systems


Functional safety issues have long been an important part of product development wherever machine operations that are potentially dangerous for humans are carried out unattended. However, in terms of electrical and electronic systems, the need has been limited to a few industries such as medical technology and aerospace. Apart from that, the functional safety concepts were only used for niche p... » read more

LDFO SiP For Wearables & IoT With Heterogeneous Integration


Authors A. Martins*, M. Pinheiro*, A. F. Ferreira*, R. Almeida*, F. Matos*, J. Oliveira*, Eoin O´Toole*, H. M. Santos†, M. C. Monteiro‡, H. Gamboa‡, R. P. Silva* ‡Fraunhofer Portugal AICOS, Porto, Portugal †INESC TEC *AMKOR Technology Portugal, S.A. ABSTRACT The development of Low-Density Fan-Out (LDFO), formerly Wafer Level Fan-Out (WLFO), platforms to encompass the require... » read more

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