tag: Fraunhofer

Cheaper Fan-Outs Ahead
By Mark LaPedus - 07 Aug, 2017 - Comments: 6

Packaging houses continue to ramp up fan-out wafer-level packages in the market, but customers want lower cost fan-out products for a broader range of applications, such as consumer, RF and smartphones. So in R&D, the industry for some time has been developing next-generation fan-out using a panel-level format, a technology that could potentially lower the cost of fan-out. But there are ... » read more

System Bits: Aug. 1
By Linda Christensen - 01 Aug, 2017 - Comments: 0

Quantum Computing Takes A Step Forward UCLA physicists have developed a technique for measuring and controlling the energy differences of electron valley states in silicon quantum dots, which they view as a key component of quantum computing. Joshua Schoenfield, a UCLA graduate student and one of the paper's authors, explained that "an individual qubit can exist in a complex wave-like m... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Apr, 2017 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has expanded its process portfolio within its joint fab venture in China. The Taiwan government has approved UMC’s application to license its 28nm technology to its subsidiary company in China--United Semiconductor. The subsidiary has been ramping up 40nm technology. “This licensing approval will help Fab 12X to ramp its manufacturing scale, e... » read more

Saving Energy In The Fab
By Katherine Derbyshire - 09 Nov, 2016 - Comments: 7

It’s not an exaggeration to say that integrated circuits are a critical component of any effort to reduce global carbon dioxide emissions. The most efficient engines depend on microcontrollers to optimize fuel consumption. Global shipping uses sophisticated simulators for load balancing and route planning. Computing power that once needed room-sized cooling units now fits in a battery-powered... » read more

Manufacturing Bits: March 15
By Mark LaPedus - 15 Mar, 2016 - Comments: 0

More multi-beam The multi-beam e-beam market is a hot topic. For example, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications. Meanwhile, at the recent SPIE Advanced Lithography conference, Mapper Lithography disclosed new upgrades for its multi-beam e-beam tool for use in direct-write lithography application... » read more

Power/Performance Bits: Feb. 2
By Jesse Allen - 02 Feb, 2016 - Comments: 0

Single electron transistors A group coordinated by the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) is setting out on a four year program to develop single electron transistors fully compatible with CMOS technology and capable of room temperature operation. The single electron transistor (SET) switches electricity by means of a single electron. The SET is based on a quantum dot (consisting... » read more

What’s Next In Mobile Displays
By Mark LaPedus - 17 Dec, 2015 - Comments: 0

The next wave of smartphones and wearables is invading the market. These systems will feature a new class of high-resolution displays, and in the near future displays will become foldable and rollable, although there are still some challenges with this technology. To be sure, mobile display technology is advancing on several fronts. On one front, for example, Apple and other systems vendor... » read more

Manufacturing Bits: Nov. 11
By Mark LaPedus - 11 Nov, 2014 - Comments: 0

Plastic smartwatch displays LG Display has begun production of what the company claims is the world’s first circular plastic OLED (P-OLED) display. The P-OLED is the display for the company’s new smartwatch, the LG G Watch R. Based on the Android Wear operating system, the smartwatch is powered by Qualcomm’s 1.2-GHz Snapdragon 400 processor. It also has 4GB of storage and 512MB of RAM... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Oct, 2014 - Comments: 0

It’s official: IBM appears to be exiting the chip business. After months of talks, IBM has agreed to pay GlobalFoundries $1.5 billion to take Big Blue’s chip unit off its hands, according to reports from Bloomberg. IBM will also receive $200 million worth of assets, according to the reports. At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel and IBM will present... » read more

What Comes Next?
By SEMI - 27 Jun, 2014 - Comments: 0

The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 (www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between sem... » read more

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