What’s Next For Power Electronics? Beyond Silicon

By Emily Yan - 29 Feb, 2024 - Comments: 0

For more than half a century, silicon has been the bedrock of power electronics. Yet as silicon meets its physical limitations in higher-power, higher-temperature applications, the industry’s relentless pursuit of more efficient power systems has ushered in the wide bandgap (WBG) semiconductors era. The global WBG semiconductors market reached $1.6 billion in 2022, with an estimated CAGR of ... » read more

Why Is The Power Device Market So Hot Right Now?

By Dermott Lynch - 25 Jan, 2024 - Comments: 0

Growing adoption of electric vehicles (EVs) and renewable energy sources is putting the spotlight on power semiconductor devices. These power devices have always been essential in determining the efficiency of a variety of systems, from small household electronics to equipment used in outer space. But as calls to reduce carbon emissions get louder, the market for these chips continues to flouri... » read more

Using TCAD To Simulate Wide-Bandgap Materials For Electronics Design

By Shela Aboud - 22 Jan, 2024 - Comments: 0

Wide-bandgap (WBG) semiconductors are a class of materials that can offer a range of advantages over silicon. These materials can operate at higher voltages and higher temperatures, serving as critical enablers of innovation in Power and RF applications and functioning in a wider range of environments that are sometimes extreme. Electronics applications benefit from these wide-bandgap materials... » read more

Properties Of The State-Of-The-Art Commercially Available SiC and GaN Power Transistors

By Technical Paper Link - 15 Jan, 2024 - Comments: 0

A technical paper titled “Review and Outlook on GaN and SiC Power Devices: Industrial State-of-the-Art, Applications, and Perspectives” was published by researchers at University of Padova. Abstract: "We present a comprehensive review and outlook of silicon carbide (SiC) and gallium nitride (GaN) transistors available on the market for current and next-generation power electronics. Materi... » read more

Addressing Trench Structures And Larger Wafers For Power Devices

By Vamsi Velidandla - 07 Nov, 2023 - Comments: 0

Wind power. Rail. Solar energy. And, perhaps most significantly, electric and hybrid vehicles. Together, these four forces are among the major demand drivers for power devices. While silicon (Si) still plays a role in power devices, wide-bandgap compound semiconductors like silicon carbide (SiC) and gallium nitride (GaN) are particularly well-suited for power devices thanks to their higher e... » read more

Four Vertical Power Delivery Architectures For Emerging Packaging and Integration Platforms (UIC)

By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “Vertical Power Delivery for Emerging Packaging and Integration Platforms – Power Conversion and Distribution” was published by researchers at University of Illinois Chicago. Abstract: "Efficient delivery of current from PCB to point-of-load (POL) is a primary concern in modern high-power high-density integrated systems. Traditionally, a 48 V power signal is con... » read more

The Ultimate Guide To PCB Layout For GaN Transistors

By Francesco Di Domenico - 05 Oct, 2023 - Comments: 0

In the ever-evolving landscape of power electronics, the emergence of gallium nitride (GaN) transistors has ignited a revolution by offering unparalleled benefits, including remarkable efficiency and power density enhancements. The art of PCB layout has been a crucial component in power electronic design for over four decades now, ever since the advent of switching power supplier. From the ea... » read more

Noise Parameter Survey Of Millimeter Wave GaN HEMT Technologies

By Technical Paper Link - 03 Oct, 2023 - Comments: 0

A technical paper titled “A Survey of GaN HEMT Technologies for Millimeter-Wave Low Noise Applications” was published by researchers at Wright-Patterson AFB, Teledyne Scientific, HRL Laboratories, BAE Systems, Pseudolithic, Northrop Grumman Corporation, and University of California Santa Barbara. "This article presents a set of measured benchmarks for the noise and gain performance of si... » read more

Improving ML-Based Device Modeling Using Variational Autoencoder Techniques

By Technical Paper Link - 27 Sep, 2023 - Comments: 0

A technical paper titled “Improving Semiconductor Device Modeling for Electronic Design Automation by Machine Learning Techniques” was published by researchers at Commonwealth Scientific and Industrial Research Organisation (CSIRO), Peking University, National University of Singapore, and University of New South Wales. Abstract: "The semiconductors industry benefits greatly from the integ... » read more

Wide Bandgap Semiconductors: What Modeling Challenges Must We Overcome

By Emily Yan - 24 Aug, 2023 - Comments: 0

As power electronics shrink in size, the demands on power, frequency, and efficiency grow exponentially. The semiconductor industry is leaning heavily into wide bandgap materials like gallium nitride (GaN) and silicon carbide (SiC) to help meet these demands. Recent research projects that the global GaN semiconductor devices market will grow at a CAGR of 25.4% from 2023 to 2030. However, the ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it?

by Brian Bailey

tag: gallium nitride

What’s Next For Power Electronics? Beyond Silicon

Why Is The Power Device Market So Hot Right Now?

Using TCAD To Simulate Wide-Bandgap Materials For Electronics Design

Properties Of The State-Of-The-Art Commercially Available SiC and GaN Power Transistors

Addressing Trench Structures And Larger Wafers For Power Devices

Four Vertical Power Delivery Architectures For Emerging Packaging and Integration Platforms (UIC)

The Ultimate Guide To PCB Layout For GaN Transistors

Noise Parameter Survey Of Millimeter Wave GaN HEMT Technologies

Improving ML-Based Device Modeling Using Variational Autoencoder Techniques

Wide Bandgap Semiconductors: What Modeling Challenges Must We Overcome

Trending Articles

NAND Flash Targets 1,000 Layers

Testing For Thermal Issues Becomes More Difficult

Auto Chip Aging Accelerates In Hot Climates

Is In-Memory Compute Still Alive?

Baby Steps Toward 3D DRAM

Knowledge Centers
Entities, people and technologies explored