Foundries Versus OSATs


Since the 1990s, commercial foundries have ruled semiconductor manufacturing while the [getkc id='83' comment='OSAT'] providers (OSATs) have dominated IC packaging and testing. But as the industry moves toward stacked die over the next couple of years, and big foundries see a chance to expand their reach, the stage is set for an all-out war. There is much at stake on both sides. Foundries g... » read more

Server Memory: What Drives Its Growth?


I was recently reading several analyst reports that came out after the end of last quarter, and one caught my eye: "Gartner says Worldwide Server Shipments Grew 1.4%..." It caused me to wonder, how is it possible that server shipments only grow at modest rates, while the DRAM used in those servers is growing at significantly higher rates? Putting my search engine to use, I found a series of ... » read more

Stacked Die Are Coming Soon. Really


Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

The Week In Review: Manufacturing


GlobalFoundries’ campus in upstate New York employs over 2,200 workers. It is looking to add 600-800 more people by the end of 2014. The company is seeking out engineers with four-year degrees and technicians with associates degrees. It is also bringing in engineers from IBM to ramp its fab in New York. Applied Materials introduced the Endura Ventura PVD system that helps reduce the cost o... » read more

EDA Economics Changing


From most perspectives, there has never been a better time to be in the EDA business. Automation tools are in demand as complexity rises, and new companies jumping into the semiconductor business are starting out with commercially available tools rather than developing their own—and taking years, sometimes even decades, to replace them. EDA’s slice of the semiconductor market consistent... » read more

The Week In Review: Manufacturing


Intel has submitted a business plan to upgrade its fab in Israel, according to reports. Crocus Nano Electronics (CNE), the joint venture founded in 2011 by Crocus Technology and Russia’s RUSNANO, has raised $60 million from its investors. The venture is Russia’s first 300mm fab. This first production line was completed one year after construction began. Currently, 200mm and 300mm CMOS wa... » read more

The Week In Review: Manufacturing


Worldwide semiconductor capital equipment spending is projected to total $37.5 billion in 2014, an increase of 12.2% from 2013 spending of $33.5 billion, according to Gartner. Capital spending will increase 5.5% in 2014 as the industry begins to recover from the recent economic downturn. The 3D NAND market will take longer to develop. Samsung has shipped a 3D NAND device. Micron and SK Hynix... » read more

Billions And Billions Invested


Over the years, next-generation [getkc id="80" kc_name="lithography"] (NGL) has suffered various setbacks and delays. But until recently, the industry basically shrugged its shoulders and expressed relatively little anxiety about the NGL delays. After all, optical lithography was doing the job in the fab and NGL would eventually materialize. Today, however, the mood is different. In fact, th... » read more

The Week In Review: Manufacturing


Don't look now, but the fab tool market is slowing. "After recent meetings in the supply chain plus examining comments from the largest spenders, we conclude that wafer fab equipment (WFE) could disappoint this year. We calculate approximately $30 billion to $31 billion in WFE spending in 2014, flattish from 2013, compared to expectations of $32 billion to $33 billion, which would be up 10%+. T... » read more

The Week In Review: Design


Tools Mentor Graphics rolled out a new platform for verification of unknown voltage levels (Xs) at the register transfer and gate levels, fusing together simulation and formal verification under one umbrella. The company says the approach will limit bugs and wasted effort caused by X-optimism and pessimism. Jasper Design Automation unveiled a new tool to verify the sequential functional equ... » read more

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