tag: Georgia Tech

System Bits: Oct. 6
By Ann Mutschler - 06 Oct, 2015 - Comments: 0

Tiny graphene pores for sensors In fundamental work that will likely guide current and future graphene membrane design principles in years to come, MIT researchers have created tiny pores in single sheets of graphene that have an array of preferences and characteristics similar to those of ion channels in living cells, and which could be useful as sensors. The researchers pointed out that e... » read more

Manufacturing Bits: Sept. 29
By Mark LaPedus - 29 Sep, 2015 - Comments: 0

Turning the nano-wrench The University of Vermont has developed a wrench that has linewidth geometries at 1.7nm. The so-called nano-wrench is an atomic-level tool, which could one day be used to create tiny structures and molecules. The nano-wrench has been devised using a technology called chirality-assisted synthesis (CAS). Chirality is derived from the Greek word for hand. If one holds u... » read more

Power/Performance Bits: Sept. 29
By Jesse Allen - 29 Sep, 2015 - Comments: 0

Optical rectenna Engineers at the Georgia Institute of Technology demonstrated the first optical rectenna, a device that combines the functions of an antenna and a rectifier diode to convert light directly into DC current. Based on multiwall carbon nanotubes and tiny rectifiers fabricated onto them, the optical rectennas could provide a new technology for photodetectors that would operate... » read more

Interconnect Challenges Grow
By Mark LaPedus - 20 Aug, 2015 - Comments: 1

It’s becoming apparent that traditional chip scaling is slowing down. The 16nm/14nm logic node took longer than expected to unfold. And the 10nm node and beyond could suffer the same fate. So what’s the main cause? It’s hard to pinpoint the problem, although many blame the issues on lithography. But what could eventually hold up the scaling train, and undo Moore’s Law, is arguably t... » read more

Manufacturing Bits: August 11
By Mark LaPedus - 11 Aug, 2015 - Comments: 0

World neutrino record The U.S. Department of Energy’s Fermi National Accelerator Laboratory has achieved a world record for high-energy neutrino experiments. In one neutrino experiment, researchers sustained a 521-kilowatt beam generated by the organization’s so-called Main Injector particle accelerator. The previous record was a 400-plus-kilowatt beam, which was accomplished at CERN. ... » read more

Energy Harvesting Update
By Ed Sperling - 18 May, 2015 - Comments: 0

Manos Tentzeris, professor of electrical and computer engineering at the Georgia Institute of Technology, sat down with Semiconductor Engineering to discuss energy harvesting. What follows are excerpts of that conversation. SE: What is the state of energy harvesting and are we making progress. Tentzeris: The latest results are systems with efficiency up to 40% to 45% utilizing ambient UH... » read more

Manufacturing Bits: March 31
By Mark LaPedus - 31 Mar, 2015 - Comments: 0

Shish kebab nano necklaces Using a directed self-assembly (DSA) process, Georgia Institute of Technology has developed a method to make nanometer-scale, chip-based necklaces. The technique could enable organic-inorganic structures, which resemble a tiny shish kebab or a centipede. The structures are made with various materials, such as semiconductors, magnetics, ferroelectrics and others. ... » read more

Manufacturing Bits: Dec. 16
By Mark LaPedus - 16 Dec, 2014 - Comments: 0

Space DSA NASA's Physical Science Research Program is taking directed self-assembly (DSA) technology to new heights. On the International Space Station, astronauts are exploring the development of nanoparticles suspended in magnetorheolocial (MR) fluids. MR fluids, which are a new class of smart materials, self-assemble into shapes in the presence of a magnetic field. With the technology, r... » read more

Power/Performance Bits: Oct. 21
By Ann Mutschler - 21 Oct, 2014 - Comments: 0

Sound power While medical researchers would like to plant tiny electronic devices deep inside our bodies to monitor biological processes and deliver pinpoint therapies or relieve pain, so far engineers have been unable to make such devices small and useful enough. Providing power to the implants has been one stumbling block, and the use of wires or batteries to deliver power make implants ... » read more

Multi-Die Packaging Gains Steam
By Si2 - 06 Oct, 2014 - Comments: 0

By Herb Reiter Many readers will be familiar with my extensive background and focus in the emerging field of 3D IC technology, including both 3D stacked die and 2.5 interposer design flows. Now, I am excited to bring my expertise and passion to Silicon Integration Initiative (Si2), where I am now Director of 3D Programs, helping Si2’s members in the Open3D Technical Advisory Board develop pr... » read more

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