System Bits: Sept. 3

By Ann Mutschler - 03 Sep, 2013 - Comments: 0

Maintaining an unstable quantum system In an experiment that could have implications for quantum computers and quantum simulators, researchers at the Georgia Institute of Technology have demonstrated a way to maintain an unstable quantum system by applying bursts of microwave radiation – a quantum analog to vibrating the inverted pendulum. While a simple pendulum has two equilibrium point... » read more

System Bits: August 20

By Ann Mutschler - 20 Aug, 2013 - Comments: 0

RF jammer technology To thwart electronic warfare technology, a research team at the Georgia Tech Research Institute (GTRI) is developing a new generation of advanced radio frequency (RF) jammer technology as part of a project known as Angry Kitten by using commercial electronics, custom hardware development, novel machine-learning software and a unique test bed to evaluate unprecedented level... » read more

System Bits: August 13

By Ann Mutschler - 13 Aug, 2013 - Comments: 0

Analyzing ad hoc networks Now that the basic protocols of the Internet are more than 30 years old, network scientists are increasingly turning attention to ad hoc networks in which communications networks set up, on the fly, by wireless devices. Here, unsolved problems still abound. Most theoretical analyses of ad hoc networks have assumed that the communications links within the network ar... » read more

Manufacturing Bits: Aug. 6

By Ed Sperling - 06 Aug, 2013 - Comments: 0

Printing Ears Engineered cartilage is an option for auricular reconstruction. Enabling the development of engineered cartilage, Massachusetts General Hospital has fabricated a bioartificial ear using a 3D printer technology. The ear looks and mechanically behaves like a human one. Researchers used a titanium wire framework within a composite collagen ear-shaped scaffold to maintain the dime... » read more

Betting On Glass TSVs

By Ed Sperling - 22 Sep, 2011 - Comments: 0

By Ed Sperling There are two big issues when it comes to through-silicon vias. One involves cost. The second involves heat—in particular, how to get heat out of a stacked die and what the thermal coefficient of the TSV will be to make sure it expands at a rate consistent with the SoCs in a package. To address these issues, System-Level Design caught up with Rao Tummala, professor of elect... » read more

Grappling With Graphene

By Brian Fuller - 11 Mar, 2010 - Comments: 0

By Brian Fuller Silicon CMOS is a tough act to follow. The workhorse building block for the world’s electronics has been delivering for system designers for a half century. Despite hand-wringing over its apparent scalability limits, it shows only vague signs of slowing down. For nearly as many years, it seems, the next great material or alternative to silicon CMOS has popped into the indu... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer