tag: Georgia Tech

Security Technical Paper Roundup: Aug. 27
By Liz Allan - 27 Aug, 2024 - Comments: 0

A number of hardware security-related technical papers were presented at the August 2024 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, logic locking, Rowhammer, and more. Here are some highlights with associate... » read more

Chip Industry Technical Paper Roundup: August 13
By Linda Christensen - 13 Aug, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=249 /] More ReadingTechnical Paper Library home   » read more

Secure Low-Cost In-DRAM Trackers For Mitigating Rowhammer (Georgia Tech, Google, Nvidia)
By Technical Paper Link - 01 Aug, 2024 - Comments: 0

A new technical paper titled "MINT: Securely Mitigating Rowhammer with a Minimalist In-DRAM Tracker" was published by researchers at Georgia Tech, Google, and Nvidia. Abstract "This paper investigates secure low-cost in-DRAM trackers for mitigating Rowhammer (RH). In-DRAM solutions have the advantage that they can solve the RH problem within the DRAM chip, without relying on other parts of ... » read more

Co-optimizing HW Architecture, Memory Footprint, Device Placement And Per-Chip Operator Scheduling (Georgia Tech, Microsoft)
By Technical Paper Link - 28 Jul, 2024 - Comments: 0

A technical paper titled “Integrated Hardware Architecture and Device Placement Search” was published by researchers at Georgia Institute of Technology and Microsoft Research. Abstract: "Distributed execution of deep learning training involves a dynamic interplay between hardware accelerator architecture and device placement strategy. This is the first work to explore the co-optimization ... » read more

Chip Industry Technical Paper Roundup: May 13
By Linda Christensen - 13 May, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=225 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 10 May, 2024 - Comments: 0

Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys' recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys' president and CEO, said in... » read more

Chip Industry Technical Paper Roundup: April 30
By Linda Christensen - 30 Apr, 2024 - Comments: 0

These new technical papers were recently added to Semiconductor Engineering’s library. [table id=222 /] Find more technical papers here. » read more

Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition (Penn State, et al.)
By Technical Paper Link - 16 Apr, 2024 - Comments: 0

A new technical paper titled "In-Operando Spatiotemporal Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition" was published by researchers at Pennsylvania State University, Cornell University, Argonne National Lab, Georgia Tech and Forschungsverbund Berlin. Abstract "The drive toward non-von Neumann device architectures has led to an intense focus on ins... » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Week In Review
By The SE Staff - 05 Apr, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. The Japanese government approved $3.9 billion in funding for chipmaker Rapidus to expand its foundry business, of which 10% will be invested in advanced packaging. This is in addition to the previously announced $2.18 billion in funding. In a meeting next week, the U.S. and Japan are expected to cooperate on increasing semiconductor development a... » read more

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