Chip Industry Week in Review


Lines are blurring between government and industry: On the heels of last week's resignation demand, Intel CEO Lip-Bu Tan met with President Trump on Monday, with the President later saying, "The meeting was a very interesting one. His success and rise is an amazing story."  Now, Bloomberg reports the Trump administration is in talks with Intel for the U.S. government to take a stake in th... » read more

In-NAND Self-Encryption Architecture In A 4D-NAND Structure (DGIST, Georgia Tech Et Al.)


A new technical paper titled "FlashVault: Versatile In-NAND Self-Encryption with Zero Area Overhead" was published by researchers at DGIST, Georgia Tech, POSTECH, Samsung Electronics, Virginia Tech, and Korea University. Abstract "We present FlashVault, an in-NAND self-encryption architecture that embeds a reconfigurable cryptographic engine into the unused silicon area of a state-of-the-ar... » read more

Chip Industry Technical Paper Roundup: August 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=460 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


The U.S. government announced new import tariff actions and deals this week, including: The EU: 15% tariff on most goods including semiconductors. According to the EU's president, the action excludes semiconductor equipment. Copper: 50% tariff on all imports of semi-finished copper products and intensive copper derivative products, effective Aug. 1, but raw input material is excluded. ... » read more

Chip Industry Technical Paper Roundup: July 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=456 /] Find more semiconductor research papers here.   » read more

Chip Industry Week in Review


The U.S. government will grant licenses to NVIDIA and AMD to again sell some AI chips — NVIDIA's H20 GPU and AMD's MI308 — to Chinese companies. TrendForce projects that the availability of NVIDIA chips, in particular, will create a surge in demand from Chinese AI firms and cloud service providers, and boost high-bandwidth memory (HBM) consumption. The move could raise China’s share of... » read more

Co-Designing Data Center Architecture To Support LLMs (Intel, Georgia Tech)


A new technical paper titled "Scaling Intelligence: Designing Data Centers for Next-Gen Language Models" was published by Intel Corporation and Georgia Tech. An excerpt from the paper's abstract: "Our work provides a comprehensive co-design framework that jointly explores FLOPS, HBM bandwidth and capacity, multiple network topologies (two-tier vs. FullFlat optical), the size of the scale-ou... » read more

Chip Industry Technical Paper Roundup: July 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=445 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


[Editor's Note: Early edition due to the U.S. July 4th holiday.] The U.S. government lifted export restrictions that barred Synopsys, Siemens EDA, and Cadence from selling EDA tools to China. In a statement, Synopsys said it received a letter from the U.S. Commerce Department immediately rescinding those restrictions. Siemens issued a similar statement. Which tools or hardware accelerated t... » read more

Stacking Persistent Embedded Memories Based On Oxide Transistors Upon GPGPU Platforms (Georgia Tech)


A new technical paper titled "CMOS+X: Stacking Persistent Embedded Memories based on Oxide Transistors upon GPGPU Platforms" was published by Georgia Tech. Abstract "In contemporary general-purpose graphics processing units (GPGPUs), the continued increase in raw arithmetic throughput is constrained by the capabilities of the register file (single-cycle) and last-level cache (high bandwidth... » read more

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