tag: Georgia Tech

Antiferroelectric negative capacitance from a structural phase transition in zirconia
By Technical Paper Link - 12 Apr, 2022 - Comments: 0

New research paper from 24-person research team from Berkeley, Georgia Tech, MIT, and other institutions. Abstract "Crystalline materials with broken inversion symmetry can exhibit a spontaneous electric polarization, which originates from a microscopic electric dipole moment. Long-range polar or anti-polar order of such permanent dipoles gives rise to ferroelectricity or antiferroelectrici... » read more

Nonvolatile Capacitive Crossbar Array for In-Memory Computing
By Technical Paper Link - 29 Mar, 2022 - Comments: 0

Abstract "Conventional resistive crossbar array for in-memory computing suffers from high static current/power, serious IR drop, and sneak paths. In contrast, the “capacitive” crossbar array that harnesses transient current and charge transfer is gaining attention as it 1) only consumes dynamic power, 2) has no DC sneak paths and avoids severe IR drop (thus, selector-free), and 3) can be f... » read more

NeuroSim Simulator for Compute-in-Memory Hardware Accelerator: Validation and Benchmark
By Technical Paper Link - 20 Dec, 2021 - Comments: 0

Abstract:   "Compute-in-memory (CIM) is an attractive solution to process the extensive workloads of multiply-and-accumulate (MAC) operations in deep neural network (DNN) hardware accelerators. A simulator with options of various mainstream and emerging memory technologies, architectures, and networks can be a great convenience for fast early-stage design space exploration of CIM hardw... » read more

Will Monolithic 3D DRAM Happen?
By Bryon Moyer - 09 Sep, 2021 - Comments: 1

As DRAM scaling slows, the industry will need to look for other ways to keep pushing for more and cheaper bits of memory. The most common way of escaping the limits of planar scaling is to add the third dimension to the architecture. There are two ways to accomplish that. One is in a package, which is already happening. The second is to sale the die into the Z axis, which which has been a to... » read more

FeFETs Bring Promise And Challenges
By Bryon Moyer - 17 Feb, 2021 - Comments: 3

Ferroelectric FETs (FeFETs) and memory (FeRAM) are generating high levels of interest in the research community. Based on a physical mechanism that hasn’t yet been commercially exploited, they join the other interesting new physics ideas that are in various stages of commercialization. “FeRAM is very promising, but it's like all promising memory technologies — it takes a while to get b... » read more

5G as a wireless power grid
By Technical Paper Link - 31 Jan, 2021 - Comments: 0

Abstract "5G has been designed for blazing fast and low-latency communications. To do so, mm-wave frequencies were adopted and allowed unprecedently high radiated power densities by the FCC. Unknowingly, the architects of 5G have, thereby, created a wireless power grid capable of powering devices at ranges far exceeding the capabilities of any existing technologies. However, this potential c... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Apr, 2020 - Comments: 0

COVID-19/Medical Mentor's parent company Siemens is making its Additive Manufacturing (AM) Network, along with its 3D printers, available to the global medical community. MEMS is at the forefront of SARS-CoV-2 testing, writes Alissa M. Fitzgerald, founder of AMFitzgerald in a blog on SEMI.org. Fitzgerald points out a MEMS silicon PCR chip, developed by Northrup et. al. at Lawrence Livermore... » read more

Scaling Up Compute-In-Memory Accelerators
By Katherine Derbyshire - 19 Mar, 2020 - Comments: 3

Researchers are zeroing in on new architectures to boost performance by limiting the movement of data in a device, but this is proving to be much harder than it appears. The argument for memory-based computation is familiar by now. Many important computational workloads involve repetitive operations on large datasets. Moving data from memory to the processing unit and back — the so-called ... » read more

Challenges In Printed And Disposable Chips
By Susan Rambo And Ed Sperling - 05 Mar, 2020 - Comments: 0

Printing inexpensive chips using technology developed for newspapers and magazines is gaining traction across a wide range of applications, from photovoltaic cells to sensors on a flexible substrate. But it's also adding a slew of new challenges that are unique to this approach. The world of flexible hybrid electronics (FHE) — printing integrated circuits on or attaching thin IC chips to a... » read more

Stacking Memory On Logic, Take Two
By Ed Sperling - 19 Sep, 2019 - Comments: 1

True 3D-ICs, where a memory die is stacked on top of a logic die using through-silicon vias, appear to be gaining momentum. There are a couple reasons why this is happening, and a handful of issues that need to be considered before even seriously considering this option. None of this is easy. On a scale of 1 to 10, this ranks somewhere around 9.99, in part because the EDA tools needed to rem... » read more

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