Boosting Memory Bandwidth Availability By Salvaging Idle I/O Bandwidth Resources (Georgia Tech)


A new technical paper titled "Pushing the Memory Bandwidth Wall with CXL-enabled Idle I/O Bandwidth Harvesting" was published by researchers at Georgia Institute of Technology. Abstract "The continual increase of cores on server-grade CPUs raises demands on memory systems, which are constrained by limited off-chip pin and data transfer rate scalability. As a result, high-end processors ty... » read more

Chip Industry Week In Review


Breaking news: Nvidia and Synopsys announced a multi-faceted, multi-year deal that includes everything from digital twins to CUDA programming, engineering, and marketing collaboration, and Nvidia's $2B purchase of Synopsys stock. [Updated 12/1] Memory news: Micron is building a $9.6B HBM facility in the city of Higashi-Hiroshima Japan, reports Nikkei. China's ChangXin Memory Technol... » read more

Chip Industry Technical Paper Roundup: Nov. 18


New technical papers recently added to Semiconductor Engineering’s library: [table id=492 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


Samsung reportedly is hiking memory chip prices by 30% to 60% due to high demand from AI data centers and constrained supplies. Those shortages are causing ripples elsewhere. SMIC, China's largest foundry, said its customers are holding back orders for other types of semiconductor due to concerns about memory supplies. Meanwhile, interest in photonics and power semiconductors is picking up, ... » read more

Interplay Between the Row Hammer Effect and Floating Body Effect in Monolithic 3D Stackable 1T1C DRAM (Georgia Tech)


A new technical paper titled "Row Hammer Effect and Floating Body Effect of Monolithic 3D Stackable 1T1C DRAM" was published by researchers at Georgia Institute of Technology. Abstract "Monolithic 3D stackable 1T1C DRAM technology is on the rise, with initial prototypes reported by the industry. This work presents a comprehensive reliability study focusing on the intricate interplay between... » read more

Chip Industry Week in Review


SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

Chip Industry Technical Paper Roundup: Nov. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=488 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

Performance Of A Memory System With FeRAM vs. DRAM (Georgia Tech, Imec, NTUA)


A new technical paper titled "Benchmarking of FERAM-Based Memory System by Optimizing Ferroelectric Device Model" was published by researchers at Georgia Tech, imec and National Technical University of Athens. Abstract "We present a framework for design technology co-optimization (DTCO) of the main memory system with one transistor-one capacitor (1T1C) ferroelectric random access memory (FE... » read more

Chip Industry Week in Review


Retaliations and countermoves leading up to planned trade talks between the U.S. and China led experts to wonder, 'Who's winning?' New activity on this front: China issued questionnaires to some U.S. semiconductor firms as part of an anti-dumping probe, demanding detailed data on sales, profit margins, logistics costs and Chinese customer names for analog chips. The probe appears aimed at ... » read more

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