tag: Georgia Tech

Chip Industry’s Technical Paper Roundup: Dec. 5
By Linda Christensen - 05 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=67 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for u... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Dec, 2022 - Comments: 0

Automotive, Mobility The U.S. space agency NASA entered a $57.2 million contract with ICON to develop technology to build roads on the moon. ICON, a Texas-based 3D printing construction company, has been working with NASA and the U.S. Air Force on construction technologies that can use local materials to build infrastructure on Mars. NASA is working on advanced 3D printing construction systems... » read more

HW Security: Fingerprints Of Digital Circuits Using Electromagnetic Side-Channel Sensing & Simulations (Georgia Tech)
By Technical Paper Link - 01 Dec, 2022 - Comments: 0

A technical paper titled "Circuit Activity Fingerprinting Using Electromagnetic Side-Channel Sensing and Digital Circuit Simulations" was published by researchers at Georgia Tech. The work "introduces a novel circuit identification method based on “fingerprints” of periodic circuit activity that does not rely on any circuit-specific reference measurements. We capture these “fingerprint... » read more

Blog Review: Oct. 5
By Jesse Allen - 05 Oct, 2022 - Comments: 0

Arm's Andrew Pickard chats with Georgia Tech's Azad Naeemi and Da Eun Shim about an effort to evaluate the benefit of new interconnect materials and wire geometry and determine their impacts at the microprocessor level. Synopsys' Shekhar Kapoor shares highlights from a recent panel exploring the promises, challenges, and realities of 3D IC technology, including the potential of 3D nanosystem... » read more

Strengthening The Global Semi Supply Chain
By Ann Mutschler - 22 Sep, 2022 - Comments: 0

Within the semiconductor ecosystem, there are a number of dynamics pointing to the need for new ways of partnering in more meaningful ways that bring resiliency to the global semiconductor supply chain. One of these is the move to bespoke silicon, stemming from a shift in the companies that create most SoCs today -- the hyperscalar cloud providers. These market leaders know their workloads so w... » read more

Technical Paper Roundup: Sept 6
By Linda Christensen - 06 Sep, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=49 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Algorithm HW Framework That Minimizes Accuracy Degradation, Data Movement, And Energy Consumption Of DNN Accelerators (Georgia Tech)
By Technical Paper Link - 31 Aug, 2022 - Comments: 0

This new research paper titled "An Algorithm-Hardware Co-design Framework to Overcome Imperfections of Mixed-signal DNN Accelerators" was published by researchers at Georgia Tech. According to the paper's abstract, "In recent years, processing in memory (PIM) based mixed-signal designs have been proposed as energy- and area-efficient solutions with ultra high throughput to accelerate DNN com... » read more

Technical Paper Round-Up: July 26
By Linda Christensen - 26 Jul, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=41 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Monolithic Microfluidic Cooling on a Functional CPU Running Real-World Benchmarks
By Technical Paper Link - 25 Jul, 2022 - Comments: 0

New technical paper titled "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management" is published by researchers at Georgia Tech and Microsoft. According to the abstract: "In this work, we use micropin-fins etched directly on the back of an Intel Core i7-8700K CPU and overclocked it to dissipate up to 215W of power while being cooled by room... » read more

Technical Paper Round-Up: July 18
By Linda Christensen - 18 Jul, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit fo... » read more

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