The Week In Review: July 15

By Mark LaPedus There are more problems surfacing with extreme ultraviolet (EUV) lithography. Yes, the light source remains a problem, but the resists appear to be in decent shape. “The next challenge is the mask blank,” said Stefan Wurm, director of Sematech’s lithography program. The new problem involves ion beam deposition, which apparently is causing defects and overfill on EUV masks... » read more

The Week In Review: July 12

By Ed Sperling Cadence rolled a new version of its layout suite of tools for electrically aware designs, allowing design teams to check on electrical issues while the layout is being done. The company says this can reduce circuit design time by up to 30%, in addition to optimizing for performance and area. Cadence also announced a deal with Global Unichip, which successfully taped out a 20nm ... » read more

Who Owns What And Why

Who’s calling the shots these days—and how long they’ll continue calling the shots—is turning out to be as much conjecture as playing the futures exchange. There are so many changes underway that even engineers are crossing boundaries no one ever expected and ending up in companies outside of IC design or moving from seemingly far afield into the design world. Still, there are some c... » read more

Who’s In Control?

By Ed Sperling A power shift is under way across the SoC world that ultimately determine who wins the business, who gets the biggest share and what technologies are ultimately used to get there. Complexity has reached a point where being able to pull the necessary pieces from a disaggregated supply chain is becoming much more difficult. That helps explain why all three of the major EDA comp... » read more

The Quest For A Better IP Integration Methodology

By Ed Sperling With the amount of IP in SoC designs now hitting an estimated 70% to 90%, companies are scrambling to figure out a way to more consistently integrate that IP and to test that it will work as expected. This is easier said than done, however, for a number of reasons: There are numerous types of IP, ranging from I/O to logic and memory. Not all IP is of equal quality. ... » read more

Journey To The Center Of The Ecosystem

From the outside it looks like business as usual, but the race for board seats on the GSA has become particularly competitive this year. GSA originally was created as an organization for fabless companies, but you wouldn’t know that looking at its membership roster. It has evolved into a who’s who of the entire semiconductor supply chain, including everyone from foundries like TSMC and... » read more

Outsourcing’s New Face

By Ed Sperling As the semiconductor industry digs out from one of the worst downturns in decades, the business of semiconductor design and engineering is changing. While the architecture and features are still being developed by chip companies, the actual work of developing the chip increasingly is being done by third parties. Outsourcing is hardly new concept in business. In the early pa... » read more

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