tag: GlobalFoundries

Week In Review: Manufacturing, Test
By Ed Sperling - 25 Jun, 2021 - Comments: 0

Lots more fabs and capacity The chip industry sees opportunity in shortages, and is racing to meet demand. SEMI reports 19 new worldwide high-volume fabs already have started construction, or will start by end of this year, and another 10 are scheduled in 2022. “Equipment spending for these 29 fabs is expected to surpass $140 billion over the next few years as the industry pushes to addre... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

Fan-Out Packaging Options Grow
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Jun, 2021 - Comments: 0

Chipmakers SiFive has received a takeover offer from Intel, according to a report from Bloomberg. The asking price is more than $2 billion. ------------------------------------------------------------------ IBM has filed suit against GlobalFoundries (GF), alleging fraud and breach of contract committed by GF. IBM’s suit, filed in the Supreme Court of the state of New York, seeks relief... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jun, 2021 - Comments: 0

Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

The Increasingly Uneven Race To 3nm/2nm
By Mark LaPedus and Ed Sperling - 24 May, 2021 - Comments: 2

Several chipmakers and fabless design houses are racing against each other to develop processes and chips at the next logic nodes in 3nm and 2nm, but putting these technologies into mass production is proving both expensive and difficult. It's also beginning to raise questions about just how quickly those new nodes will be needed and why. Migrating to the next nodes does boost performance an... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 May, 2021 - Comments: 0

Packaging and test TrendForce has released its ranking of the top OSATs in terms of sales in the first quarter of 2021. ASE remains in the top spot, followed in order by Amkor, JCET, SPIL and PTI. “Industry leaders ASE and Amkor posted revenues of $1.69 billion and $1.33 billion, which are YoY increases of 24.6% and 15.0%, respectively, in 1Q21,” according to TrendForce. “ASE graduall... » read more

Automotive IC Shortage Drags On
By Patrick Waurzyniak - 20 May, 2021 - Comments: 1

The current automotive semiconductor shortages won’t end anytime soon. When the COVID-19 pandemic hit in early 2020, it wreaked havoc on the worldwide supply chain, but it especially caught automakers flat-footed. When the auto OEMs canceled chip orders during a roughly eight-week period of plant shutdowns, they later found their supplies of critical ICs had evaporated. To make it an ev... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 May, 2021 - Comments: 0

Government policy Semiconductor companies as well hardware and software vendors have announced the formation of the Semiconductors in America Coalition (SIAC). The group called on congressional leaders to appropriate $50 billion for U.S. manufacturing incentives and research initiatives. SIAC’s mission is to advance federal policies that promote semiconductor manufacturing and research in th... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 May, 2021 - Comments: 0

Siemens Digital Industries Software acquired Fractal Technologies, a provider of tools for IP validation and comparison checks of standard cell libraries, IO, and hard IP that reports mismatches or modeling errors, as well as comparing new IP releases close to tape-out. Siemens plans to add Fractal’s technology to the Xcelerator portfolio, joining the Solido software product family, which inc... » read more

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