tag: GlobalFoundries

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 14 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Maxim Integrated’s new USB-C Power Delivery products — the MAX77958 USB-C PD controller and the MAX77962 28W buck-boost charger — are aimed at devices, such as IoT or mobile phones, that need more power or for fast charging. To shave time off development and cost when changing from single-cell to two-series cell architectures, these are USB-... » read more

Rethinking Competitive One Upmanship Among Foundries
By Ed Sperling - 03 Aug, 2020 - Comments: 2

The winner in the foundry business used to be determined by who got to the most advanced process node first. For the most part that benchmark no longer works. Unlike in the past, when all of the foundries and IDMs competed using basically the same process, each foundry has gone its own route. This is primarily due to the divergence of end markets, and the realization that as costs increase, ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 Jul, 2020 - Comments: 0

Perforce Software acquired Methodics. Founded in 2006 and based in San Francisco, Methodics' IP lifecycle management and traceability software will join Perforce's larger portfolio of DevOps software that includes version control, Agile planning, and static code analysis. The two companies have had a strategic partnership in place with customers using software from both companies. Terms of the ... » read more

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Jul, 2020 - Comments: 0

Market research After years of falling demand, the PC market is back. The second quarter of 2020 ended well for the traditional PC market, including desktops, notebooks, and workstations. Global PC shipments jumped 11.2% year-over-year reaching a total of 72.3 million units, according to IDC. As restrictions around the world tightened in the first few weeks of the quarter, demand for notebo... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Jul, 2020 - Comments: 0

IoT Arm is proposing to transfer its two IoT divisions to SoftBank Group Corp., which will own and operate them under new entities. The two IoT Services Group (ISG) businesses are IoT Platform and Treasure Data. Arm intends to focus more on its IP roadmap in data and compute, once the transfer becomes finalized. It is subject to more board review. “Arm believes there are great opportunities ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Jul, 2020 - Comments: 0

The American Foundries Act, a bipartisan initiative to revive U.S. leadership in the global microelectronics sector, was announced by U.S. Democratic Senator Chuck Schumer from New York. “The economic and national security risks posed by relying too heavily on foreign semiconductor suppliers cannot be ignored, and Upstate New York, which has a robust semiconductor sector, is the perfect place... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Jun, 2020 - Comments: 0

Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Jun, 2020 - Comments: 0

Chipmakers and OEMs At next week’s Apple Worldwide Developers Conference, Apple is expected to roll out its long-awaited Arm-based Mac computers. This could provide a boost for Apple’s foundry vendor as well as equipment makers. It’s the worst-kept secret in the industry. As reported by the Apple sites, Apple is moving from Intel’s microprocessors to its own Arm-based chips for th... » read more

The Next Advanced Packages
By Mark LaPedus - 18 Jun, 2020 - Comments: 4

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

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