Week In Review: Manufacturing, Test


Top stories Here's the latest from Reuters: ''The United States has imposed restrictions on exports to China’s biggest chip maker SMIC after concluding there is an 'unacceptable risk' equipment supplied to it could be used for military purposes." What does this all mean? “The press has reported that on Friday, the U.S. Department of Commerce placed restrictions on China's largest semicondu... » read more

Week In Review: Design, Low Power


Tools & IP Arm added two new platforms to its product roadmap: the Neoverse V1, and the Neoverse N2, the second-generation N-series platform. The V1 platform supports Scalable Vector Extensions (SVE), provides 50% better single-threaded performance over N1, and targets high-performance cloud, HPC, and machine learning applications. The N2 provides 40% higher single-threaded performance com... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The State of California has banned the selling of new vehicles with gasoline-powered internal combustion engines (ICE) by 2035. All new passenger cars sold in 15 years in California will be zero emission cars, according to an executive order signed by the state’s governor. Older ICE passenger cars will still be allowed on the roads and can still be sold as used vehicles. The order... » read more

Week In Review: Design, Low Power


Tools & IP Arm unveiled the Cortex-R82, a 64-bit, Linux-capable Cortex-R processor targeted for next-generation enterprise and computational storage solutions. The Cortex-R82 provides 2x performance depending on workload compared to previous Cortex-R generations and provides access of up to 1TB of DRAM for advanced data processing in storage applications. It offers an optional memory manag... » read more

New Architectures, Much Faster Chips


The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

Moore’s Law Enters The 4th Dimension


The basic idea that more transistors are better hasn't changed in more than half a century. In fact, the overriding theme of a number of semiconductor conferences this month is that we will never have enough compute capability or storage capacity. In the past, when the number of transistors in a given area actually did double every 18 to 24 months, increasing density per square millimeter fo... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — data center, edge, IoT SEMI formed a new standards committee to develop global standards for flexible hybrid electronics (FHE). The SEMI Standards Flexible Hybrid Electronics Global Technical Committee will develop FHE standards for design, materials, manufacturing, packaging and systems and to drive industry growth. IPC is also working on FHE standards as an industry s... » read more

Week In Review: Manufacturing, Test


Chipmakers At its Architecture Day this week, Intel disclosed its roadmap for the company’s next-generation microprocessors, graphics chips, FPGAs and other products. As part of the event, Intel announced some new enhancements for its existing 10nm finFET technology. Basically, it’s a mid-life kicker for the technology. Intel calls it the 10nm SuperFin technology, which is a redefinitio... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — data center, edge, IoT Maxim Integrated’s new USB-C Power Delivery products — the MAX77958 USB-C PD controller and the MAX77962 28W buck-boost charger — are aimed at devices, such as IoT or mobile phones, that need more power or for fast charging. To shave time off development and cost when changing from single-cell to two-series cell architectures, these are USB-... » read more

Rethinking Competitive One Upmanship Among Foundries


The winner in the foundry business used to be determined by who got to the most advanced process node first. For the most part that benchmark no longer works. Unlike in the past, when all of the foundries and IDMs competed using basically the same process, each foundry has gone its own route. This is primarily due to the divergence of end markets, and the realization that as costs increase, ... » read more

← Older posts Newer posts →