Week In Review: Auto, Security, Pervasive Computing


Synopsys has added nanoscale and macroscale illumination optics to its RSoft Photonic Device Tools version 2020.03. ARVR designers can use the RSoft-LightTools Bidirectional Scattering Distribution Function (BSDF) interface to make interpolated BSDF files for optimized nanoscale and macroscale optics, such as freeform optical prism projectors, eye tracking technologies, and optical planar waveg... » read more

Week In Review: Manufacturing, Test


Chipmakers TrendForce has released its projected foundry rankings in terms of sales for the first quarter. TSMC is still in first place, followed by Samsung, GlobalFoundries and UMC. Samsung has been ramping up chips based on its 7nm logic process using extreme ultraviolet (EUV) lithography. Now, Samsung is ramping up its DRAM devices using EUV and plans to expand its capacity in the arena.... » read more

Week In Review: Manufacturing, Test


Market research The coronavirus is having a major impact on the semiconductor, smartphone and related markets. For example, global fab equipment spending promises to rebound from its 2019 downturn and see a modest recovery this year, according to a report from SEMI. But the coronavirus (COVID-19) outbreak has eroded fab equipment spending in China and elsewhere in 2020, according to the rep... » read more

Week In Review: Auto, Security, Pervasive Computing


AI/Edge The United States Department of Defense (DOD) has adopted ethical principles for using artificial intelligence in warfare that chiefly say the U.S. has to follow the laws, treaties, in use of AI in warfare. Any AI used by DOD has to be responsible, equitable, traceable, reliable and governable. “The Department will design and engineer AI capabilities to fulfill their intended functio... » read more

Chiplet Momentum Rising


The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Demand Picks Up For 200mm


Demand is growing for both 200mm fab capacity and equipment, setting the stage for possible shortages in coming months. But there are also some uncertainties, if not warning signs, in the 200mm market and the entire IC industry. Trade disputes, as well as the current coronavirus outbreak in China, likely will impact the chip and equipment markets. The size of the impact and the duration rema... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs IC Insights has released its rankings of the 25 largest wafer capacity leaders in terms of monthly installed capacity in 200mm-equivalents as of December 2019. Samsung was in first place, followed by TSMC, Micron, SK Hynix, and Kioxia, formerly Toshiba Memory, according to IC Insights. Combined capacity of the top five companies represented 53% of total global wafer capa... » read more

Design For Airborne Electronics


The Next Generation Air Transportation System (NextGen), an FAA-led modernization of America's air transportation system meant to make flying more efficient, predictable and safer, is currently underway as one of the most ambitious infrastructure projects in U.S. history. This is not just a minor upgrade to an aging infrastructure. The FAA and partners are in the process of implementing new ... » read more

Week In Review: Manufacturing, Test


Coronavirus The coronavirus in China has been declared as a global health emergency by the World Health Organization (WHO). The situation appears to be much worse than SARS (severe acute respiratory syndrome), which hit in 2003. Several companies are taking precautionary measures to prevent widespread transmission of coronavirus. For example, ASE has devoted a Web page for the measures it is t... » read more

SiC Foundry Business Emerges


Several third-party foundry vendors are entering or expanding their efforts in the silicon carbide (SiC) business amid booming demand for the technology. However, making a significant dent in the market will not be so easy for SiC foundry vendors and their customers. They are facing stiff competition from traditional SiC device vendors such as Cree, Infineon, Rohm and STMicroelectronics. ... » read more

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