tag: GlobalFoundries

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Sep, 2019 - Comments: 0

China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Aug, 2019 - Comments: 0

Chipmakers GlobalFoundries has filed suits in the U.S. and Germany, alleging that semiconductor manufacturing technologies used by TSMC infringe upon 16 of GF's patents. The suits were filed in the U.S. International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf and Mannheim in Germ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Aug, 2019 - Comments: 0

Chipmakers In its latest move to cut costs and focus on its core business, GlobalFoundries (GF) has announced plans to jettison its U.S. photomask operations in Burlington, Vt., but the foundry vendor will maintain a stake in its joint venture mask unit. Under the plan, Toppan Photomasks will acquire certain assets of GF’s Burlington photomask facility. “GF is transferring its mask tool... » read more

Wanted: More Fab Tool Part Standards
By Mark LaPedus - 15 Aug, 2019 - Comments: 0

As chipmakers ramp up the next wave of processes and grapple with how to reduce defect levels, they are encountering problems from an unlikely source—components inside of the fab equipment. Defects are unwanted deviations in chips, which impact yields and device performance. Typically, they are caused by an unforeseen glitch during the process flow. But a lesser-known problem involves defe... » read more

Power Modeling Standard Released
By Brian Bailey - 14 Aug, 2019 - Comments: 0

Power is becoming a more important aspect of semiconductor design, but without an industry standard for power models, adoption is likely to be slow and fragmented. That is why Si2 and the IEEE decided to do something about it. Back in 2014, the IEEE expanded its interest in power standards with the creation of two new groups IEEE P2415 - Standard for Unified Hardware Abstraction and Layer fo... » read more

Yield Impact For Wafer Shape Misregistration-Based Binning For Overlay APC Diagnostic Enhancement
By KLA - 05 Aug, 2019 - Comments: 0

By David Jayez, Kevin Jock, Yue Zhou and Venugopal Govindarajulu of GlobalFoundries, and Zhen Zhang, Fatima Anis, Felipe Tijiwa-Birk and Shivam Agarwal of KLA. 1. ABSTRACT The importance of traditionally acceptable sources of variation has started to become more critical as semiconductor technologies continue to push into smaller technology nodes. New metrology techniques are needed to pur... » read more

Blog Review: July 31
By Jesse Allen - 31 Jul, 2019 - Comments: 0

Cadence's Meera Collier checks out a study that uses AI and natural language processing techniques to infer new discoveries in materials science from published academic literature and considers how it could be used in the future. Synopsys' Taylor Armerding considers whether the NIST Secure Software Development Framework, the latest standard aimed at improving software security, can succeed. ... » read more

Cloudy Outlook Seen For IC Biz
By Mark LaPedus - 29 Jul, 2019 - Comments: 0

After a slowdown in the first half of 2019, chipmakers and equipment vendors face a cloudy outlook for the second half of this year, with a possible recovery in 2020. Generally, the semiconductor industry began to see a slowdown starting in mid- to late-2018, which extended into the first half of 2019. During the first half of this year, memory and non-memory vendors were negatively impacted... » read more

200mm Cools Off, But Not For Long
By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

5nm Vs. 3nm
By Mark LaPedus - 24 Jun, 2019 - Comments: 16

Foundry vendors are readying the next wave of advanced processes, but their customers will face a myriad of confusing options—including whether to develop chips at 5nm, wait until 3nm, or opt for something in between. The path to 5nm is well-defined compared with 3nm. After that, the landscape becomes more convoluted because foundries are adding half-node processes to the mix, such as 6nm ... » read more

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