tag: GlobalFoundries

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 22 Feb, 2019 - Comments: 0

Internet of Things Cattle ranchers in Australia are using solar-powered ear tags to keep track of their herds, connecting through LoRa technology to locate their bulls, cows, heifers, and steers. SODAQ of the Netherlands and Lacuna Space of the U.K. are providing the Internet of Things technology and satellite-based LoRa connectivity to make this possible. “The main differentiator for LoRa o... » read more

FD-SOI: How Body Bias Creates Unique Differentiation
By GlobalFoundries - 21 Feb, 2019 - Comments: 0

Fully depleted silicon-on-insulator (FD-SOI) relies on a very unique substrate whose layer thicknesses are controlled at the atomic scale. FD-SOI offers remarkable transistor performance in terms of power, performance, area and cost tradeoffs (PPAC), making it possible to cover from low-power to high-performance digital applications with a single technology platform. FD-SOI delivers numerous un... » read more

In-Memory Vs. Near-Memory Computing
By Mark LaPedus - 21 Feb, 2019 - Comments: 1

New memory-centric chip technologies are emerging that promise to solve the bandwidth bottleneck issues in today’s systems. The idea behind these technologies is to bring the memory closer to the processing tasks to speed up the system. This concept isn’t new and the previous versions of the technology fell short. Moreover, it’s unclear if the new approaches will live up to their billi... » read more

Week In Review: Design, Low Power
By SE Staff - 15 Feb, 2019 - Comments: 0

Tools & IP Engineering simulation company ANSYS says thanks to new features in its ANSYS Twin Builder, product developers may be able save money in warranty and operational costs. The Twin Builder creates a digital twin of a systems in the field, enabling a convenient way to monitor and maintain systems remotely. The latest release adds predictive maintenance features for digital-twin runt... » read more

Blog Review: Feb. 13
By Linda Christensen - 13 Feb, 2019 - Comments: 0

UltraSoc’s Rupert Baines notes that awareness is rapidly increasing for the value of embedded insights and system data. Cadence’s Paul McLellan reviews the highlights of the upcoming SPIE conference in San Jose. Synopsys’ Taylor Armerding discusses the key findings of a report on cybersecurity practices for the automotive industry, including what components of vehicles pose the hi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Feb, 2019 - Comments: 0

Chipmakers and OEMs Taiwan specialty foundry vendor Vanguard International Semiconductor (VIS) will acquire GlobalFoundries’ Fab 3E facility in Singapore for $236 million. Fab 3E manages a monthly capacity of approximately 35,000 200mm wafers. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business. VIS currently has three 200mm fa... » read more

China’s Foundry Biz Takes Big Leap Forward
By Mark LaPedus - 28 Jan, 2019 - Comments: 1

China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, accordi... » read more

Embedded Phase-Change Memory Emerges
By Mark LaPedus - 24 Jan, 2019 - Comments: 3

The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

Adaptation In A Volatile Era
By Thomas Caulfield - 24 Jan, 2019 - Comments: 0

2018 has been a volatile year by almost any measure, and the global electronics industry was at the center of the action. Soaring memory prices and tech stock valuations drove eye-popping growth in the first half, with Samsung solidifying its position as the world’s largest chipmaker and Apple briefly topping $1 trillion of market capitalization. Fast forward to the second half of the year an... » read more

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

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