Blog Review: Feb. 13

UltraSoc’s Rupert Baines notes that awareness is rapidly increasing for the value of embedded insights and system data.

Cadence’s Paul McLellan reviews the highlights of the upcoming SPIE conference in San Jose.

Synopsys’ Taylor Armerding discusses the key findings of a report on cybersecurity practices for the automotive industry, including what components of vehicles pose the highest security risks.

Mentor’s Harry Foster focuses on IC/ASIC project verification technology adoption trends, including dynamic verification techniques, static verification techniques and emulation and FPGA prototyping.

ANSYS’ Shawn Wasserman highlights new tools to help designers simulate while they design, specifically simulation software that’s accelerated by GPUs.

Arm’s Charlotte Christopherson highlights recent research in microbial biophotovoltaic technology (BPV), including limitations and challenges as well as possible applications in the area of printed bioelectronics.

Coventor’s Timothy Yang dives into innovative solutions to increase 3D NAND flash memory density.

GlobalFoundries’ Dave Lammers looks at RF SOI for 5G power amps.

And in case you missed last week’s IoT, Security and Automotive newsletter, check out the these blogs:

Editor In Chief Ed Sperling warns that the problem of security in autonomous vehicles is far from solved, even though talk about it seems to be waning.

Paul Kocher, Cybersecurity Hall of Famer & security technical advisor at Rambus, analyzes progress on security attacks on today’s most popular microprocessors (μPs).

Arteris IP’s Kurt Shuler dives into ISO 26262 and how the safety standard is now clearer for IP-based designs and those happening across multiple companies.

Flex Logix’s CEO Geoff Tate looks at how the wrong benchmark can lead to incorrect conclusions.

Synopsys’ Graham Wilson addresses how to achieve flexible processing requirements for IoT end-node devices.

Mentor’s Jeff Dyck digs into why automotive IC design demands next-generation high-sigma verification.

DAC’s Design Infrastructure Alley chair & senior manager at Qualcomm’s Derek Magill highlights the big issues to be covered at DAC in June 2019.