tag: GlobalFoundries

Next EUV Challenge: Pellicles
By Mark LaPedus - 27 Apr, 2016 - Comments: 1

Extreme ultraviolet (EUV) lithography is still not ready for high-volume manufacturing, but the technology is at least moving in the right direction. Both the [gettech id="31045" comment="EUV"] light source and resists are making noticeable progress, even though there are still challenges in the arena. And then, there is the EUV mask infrastructure, which also has some gaps. “When EUV i... » read more

Blog Review: April 27
By Jesse Allen - 27 Apr, 2016 - Comments: 0

In a video, Cadence's Chris Rowan looks at the future of neural networks, particularly the shift from cloud-based to embedded devices and what we can increasingly expect from them. Waiting for RTL? Mentor's Rich Edelman suggests a way to get tests that are missing some simple RTL running with a bit of SystemVerilog. Synopsys' Richard Solomon provides a primer on calculating the bandwidth ... » read more

10nm Versus 7nm
By Mark LaPedus - 25 Apr, 2016 - Comments: 20

The silicon foundry business is heating up, as vendors continue to ramp their 16nm/14nm finFET processes. At the same time, they are racing each other to ship the next technologies on the roadmap—10nm and 7nm. But the landscape is complicated, with each vendor taking a different strategy. [getentity id="22865" e_name="Samsung"], for one, plans to ship its 10nm [getkc id="185" kc_name="fi... » read more

7nm Fab Challenges
By Mark LaPedus - 21 Apr, 2016 - Comments: 3

Leading-edge foundry vendors have made the challenging transition from traditional planar processes into the finFET transistor era. The first [getkc id="185" kc_name="finFETs"] were based on the 22nm node, and now the industry is ramping up 16nm/14nm technologies. Going forward, the question is how far the finFET can be scaled. In fact, 10nm finFETs from Samsung are expected to ramp by ye... » read more

Foundries Expand Their Scope
By Ed Sperling - 21 Apr, 2016 - Comments: 0

By Ed Sperling & Mark LaPedus Major foundries are stepping up their offerings across a wide swath of technology nodes, specialty processes and advanced packaging—a recognition that end markets are fragmenting and that the path forward includes a mix of new and established processes. As the smart phone market flattens, there is no single "next big thing" to drive volume at the most ... » read more

Cadence CDNLive Keynote Address: Thoughts and Implications
By Rich Wawrzyniak - 21 Apr, 2016 - Comments: 0

I attended the Cadence CDNLive conference at the Santa Clara Convention Center on April 5 and 6 and had a chance to listen to four very thought-provoking presentations given by the speakers. These presentations were combined to follow the keynote address given by Cadence CEO, Lip-Bu Tan and addressed several different aspects of the current semiconductor industry landscape. Speakers Lip-... » read more

Insider’s Guide To Fab Technology
By Mark LaPedus - 21 Apr, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss fab technology with Matt Paggi, vice president of advanced technology development at GlobalFoundries. What follows are excerpts of that conversation. SE: What’s driving demand for semiconductors today? Paggi: You are aware of what the worldwide semiconductor revenue growth is this year. There are peaks and valleys in the worldwide semiconduc... » read more

Blog Review: April 20
By Jesse Allen - 20 Apr, 2016 - Comments: 0

Synopsys' Michael Posner digs into the relationships between USB Type-C, USB 3.1, Power Delivery and DisplayPort specifications. Cadence's Paul McLellan listens in on a discussion of the memory market's growth in China, and what's on the horizon. Mentor's Andy Macleod looks at the challenges that come with the increased car customization consumers are demanding. An energy-harvesting, t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Apr, 2016 - Comments: 0

Chipmakers TSMC remained the world’s largest foundry vendor with a 54.3% share in 2015, according to the rankings from Gartner. GlobalFoundries moved into the No. 2 position with 9.6% of the market. The No. 3 position went to UMC with $4.5 billion in revenue, representing 9.3% of the market, according to the firm, which said Samsung remains No. 4. SMIC, which is No. 5, is gaining ground. ... » read more

Where Is Next-Gen Lithography?
By Mark LaPedus - 11 Apr, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at Imec; Harry Levinson, senior fellow and senior director of technology research at GlobalFoundries; Uday Mitra, vice president and head of strategy and marketing for the Etch Business Unit and Patterning Module at Applied Materials; Naoya Haya... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy