tag: GlobalFoundries

Power/Performance Bits: Feb. 2
By Jesse Allen - 02 Feb, 2016 - Comments: 0

Single electron transistors A group coordinated by the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) is setting out on a four year program to develop single electron transistors fully compatible with CMOS technology and capable of room temperature operation. The single electron transistor (SET) switches electricity by means of a single electron. The SET is based on a quantum dot (consisting... » read more

Upcoming Hurdles For The Semiconductor Industry
By Ann Mutschler - 01 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business at Ansys-Apache; Chris Rowen, Fellow and CTO, IP Group at Cadence; Subramani Kengeri, vice president, Global Design Solutions at GLOBALFOUNDRIES; Simon Davidmann, CEO of Imperas Software; Michael... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jan, 2016 - Comments: 0

Samsung Electronics announced that it has begun producing the industry’s first 4-gigabyte DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface. The 4GB HBM2 package is created by stacking a buffer die at the bottom and four 8-gigabit core dies on top. These are then vertically interconnected by TSV holes and microbumps. A single 8Gb HBM2 die contains over 5,000 T... » read more

Neuromorphic Chip Biz Heats Up
By Mark LaPedus - 21 Jan, 2016 - Comments: 0

It’s no secret that today’s computers are struggling to keep up with the enormous demands of data processing and bandwidth, and the whole electronics industry is searching for new ways to enable that. The traditional approach is to continue to push the limits of today’s systems and chips. Another way is to go down the non-traditional route, including an old idea that is generating stea... » read more

5nm Fab Challenges
By Mark LaPedus - 21 Jan, 2016 - Comments: 2

At a recent event, Intel presented a paper that generated sparks and fueled speculation regarding the future direction of the leading-edge IC industry. The company described a next-generation transistor called the nanowire FET, which is a finFET turned on its side with a gate wrapped around it. Intel’s nanowire FET, sometimes called a gate-all-around FET, is said to meet the device require... » read more

Will 5nm Happen?
By Mark LaPedus - 20 Jan, 2016 - Comments: 7

Chipmakers are ramping up their 16/14nm finFET processes, with 10nm finFETs expected to ship sometime in late 2016 or early 2017. So what’s next? The foundries can see a path to extend the finFET transistor to 7nm, but the next node, 5nm, is far from certain and may never happen. Indeed, there are several technical and economic challenges at 5nm. And even if 5nm happens, only a few compani... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jan, 2016 - Comments: 0

Savioke is creating autonomous robot helpers for the services industry, including hotels. The company has raised $15 million in Series A financing from lead investor Intel Capital, along with EDBI, the corporate investment arm of the Singapore Economic Development Board, and Northern Light Venture Capital. Savioke will use the funding to expand sales, marketing and product developments for its ... » read more

Advanced Packaging Is Real. Now What?
By Ed Sperling - 14 Jan, 2016 - Comments: 0

For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

Thinking Outside The Chip
By Ed Sperling - 14 Jan, 2016 - Comments: 0

Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jan, 2016 - Comments: 0

2016 is starting off on the wrong foot. Samsung disclosed its preliminary results for the forth quarter. Samsung expects a difficult business environment in 2016, according to reports. Plus, Apple is seeing lower than expected demand. “We are lowering our March quarter iPhone units to 45M units (prior 54M) to reflect incremental softness and recent production cuts. Our sense is that iPhones a... » read more

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