The Great Quantum Computing Race

By Mark LaPedus - 26 Jul, 2021 - Comments: 0

Quantum computing is heating up, as a growing number of entities race to benchmark, stabilize, and ultimately commercialize this technology. As of July 2021, a group from China appears to have taken the lead in terms of raw performance, but Google, IBM, Intel and other quantum computer developers aren’t far behind. All of that could change overnight, though. At this point, it's too early t... » read more

Behind The Intel-GlobalFoundries Rumor

By Ed Sperling - 19 Jul, 2021 - Comments: 5

A Wall Street Journal report that Intel is looking to buy GlobalFoundries has sparked discussions across the industry. But what exactly this would mean, and why now versus a couple years ago, needs some context. There are layers upon layers of irony behind this would-be deal, and it dates back decades to some rather famous encounters. Consider former AMD CEO Jerry Sanders' 1991 comment that ... » read more

Rocky Road To Designing Chips In The Cloud

By Ann Mutschler - 24 Jun, 2021 - Comments: 0

EDA is moving to the cloud in fits and starts as tool vendors sort out complex financial models and tradeoffs while recognizing a potentially big new opportunity to provide unlimited processing capacity using a pay-as-you-go approach. By all accounts, a tremendous amount of tire-kicking is happening now as EDA vendors and users delve into the how and why of moving to the cloud for chip desig... » read more

Shifting Toward Data-Driven Chip Architectures

By Ed Sperling and Ann Mutschler - 16 Jun, 2021 - Comments: 0

An explosion in data is forcing chipmakers to rethink where to process data, which are the best types of processors and memories for different types of data, and how to structure, partition and prioritize the movement of raw and processed data. New chips from systems companies such as Google, Facebook, Alibaba, and IBM all incorporate this approach. So do those developed by vendors like Appl... » read more

Ten Lessons From Three Generations Shaped Google’s TPUv4i

By Technical Paper Link - 11 Jun, 2021 - Comments: 0

Source: Norman P. Jouppi, Doe Hyun Yoon, Matthew Ashcraft, Mark Gottscho, Thomas B. Jablin, George Kurian, James Laudon, Sheng Li, Peter Ma, Xiaoyu Ma, Nishant Patil, Sushma Prasad, Clifford Young, Zongwei Zhou (Google); David Patterson (Google / Berkeley) Find technical paper here. 2021 ACM/IEEE 48th Annual International Symposium on Computer Architecture (ISCA) Abstract–"Google de... » read more

Week In Review: Design, Low Power

By Jesse Allen - 11 Jun, 2021 - Comments: 0

Siemens Digital Industries Software acquired Pro Design's proFPGA product family of FPGA desktop prototyping technologies. Through a prior OEM relationship, proFPGA technology is already part of the Xcelerator portfolio; Siemens noted that the acquisition will allow for fuller integration with its Veloce hardware-assisted verification system. Pro Design will continue to operate as an independen... » read more

The Increasingly Uneven Race To 3nm/2nm

By Mark LaPedus and Ed Sperling - 24 May, 2021 - Comments: 2

Several chipmakers and fabless design houses are racing against each other to develop processes and chips at the next logic nodes in 3nm and 2nm, but putting these technologies into mass production is proving both expensive and difficult. It's also beginning to raise questions about just how quickly those new nodes will be needed and why. Migrating to the next nodes does boost performance an... » read more

Week In Review: Design, Low Power

By Jesse Allen - 21 May, 2021 - Comments: 0

Siemens will acquire Supplyframe, a supply chain intelligence, sourcing, and marketplace platform for the electronics industry, for $700 million. The company operates on a software-as-a-service model and will serve as the nucleus of Siemens’ digital marketplace strategy, according to Cedrik Neike, member of the Managing Board of Siemens AG. “Supplyframe’s ecosystem and marketplace intelli... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 14 May, 2021 - Comments: 0

Government policy Semiconductor companies as well hardware and software vendors have announced the formation of the Semiconductors in America Coalition (SIAC). The group called on congressional leaders to appropriate $50 billion for U.S. manufacturing incentives and research initiatives. SIAC’s mission is to advance federal policies that promote semiconductor manufacturing and research in th... » read more

Standards, Open Source, and Tools

By Brian Bailey - 10 May, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering discussed what open source verification means today and what it should evolve into with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Ashish Darbari, CEO of Axiomise; Simon Davidmann, CEO of Imperas Software; Serge Leef, program manager in the Microsystems Technology Office at DARPA; Tao Liu, staff hardware engineer... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Google

The Great Quantum Computing Race

Behind The Intel-GlobalFoundries Rumor

Rocky Road To Designing Chips In The Cloud

Shifting Toward Data-Driven Chip Architectures

Ten Lessons From Three Generations Shaped Google’s TPUv4i

Week In Review: Design, Low Power

The Increasingly Uneven Race To 3nm/2nm

Week In Review: Design, Low Power

Week In Review: Manufacturing, Test

Standards, Open Source, and Tools