tag: Graphcore

New Approaches To Power Decoupling
By Bryon Moyer - 24 Oct, 2024 - Comments: 0

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. Power is a much more important factor than it used to be, especially in the era of AI. “Doing an AI search consumes 10X the power t... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Managing Voltage Variation
By Barry Pangrle - 07 Aug, 2023 - Comments: 0

Engineers make many tradeoffs when designing SoC’s to better meet design specifications. Power, Performance and Area (PPA) are the primary goals and all three impact the cost of the implementation. For example, higher power and performance can both require more expensive packaging for power and signal integrity as well as cooling. The larger the die area the fewer die per wafer which drives u... » read more

Will Floating Point 8 Solve AI/ML Overhead?
By Karen Heyman - 12 Jan, 2023 - Comments: 2

While the media buzzes about the Turing Test-busting results of ChatGPT, engineers are focused on the hardware challenges of running large language models and other deep learning networks. High on the ML punch list is how to run models more efficiently using less power, especially in critical applications like self-driving vehicles where latency becomes a matter of life or death. AI already ... » read more

New Uses For AI In Chips
By John Koon and Ed Sperling - 11 Aug, 2022 - Comments: 1

Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Paving The Way To Chiplets
By Mark LaPedus - 25 Apr, 2022 - Comments: 2

The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet standards, and a cost analysis tool for determining the feasibility of a given chiplet-based design, are two new and important pieces. Along with other efforts, the goal is to propel the chiplet m... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Mar, 2022 - Comments: 0

Tools & IP Imperas Software introduced the RISC-V Verification Interface (RVVI). The open standard and methodology can be adapted to any configuration permitted within the RISC-V specifications. RVVI defines interfaces between RTL, reference model, and testbench for RISC-V design verification, with the aim of making RISC-V processor DV reusable. It supports multi-hart, superscalar, and out... » read more

Optimization Driving Changes In Microarchitectures
By Ann Mutschler - 23 Sep, 2021 - Comments: 0

The semiconductor ecosystem is at a turning point for how to best architect the CPU based on the explosion of data, the increased usage of AI, and the need for differentiation and customization in leading-edge applications. In the past, much of this would have been accomplished by moving to the next process node. But with the benefits from scaling diminishing at each new node, the focus is s... » read more

Startup Funding: December 2020
By Jesse Allen - 06 Jan, 2021 - Comments: 1

AI hardware startups were hot in our December startup-funding focus, with two companies landing rounds exceeding $100M and plenty of others seeing investment. Two Chinese EDA companies received funding in a bid to boost the country's semiconductor ecosystem. One company providing control systems for fabs achieved $8M in Series A, and both autonomous driving and electric vehicles pulled in lots ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 13 Nov, 2020 - Comments: 0

M&A Synopsys acquired Moortec, a provider of in-chip monitoring technology specializing in process, voltage and temperature (PVT) sensors. Moortec's sensors will be a key component to Synopsys' new Silicon Lifecycle Management (SLM) platform. "This acquisition accelerates the expansion of our SLM platform by providing our customers with a comprehensive data-analytics-driven solution for de... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy