Developing Workflows To Streamline System-Level Design

By Ann Mutschler - 28 Aug, 2024 - Comments: 0

Experts At The Table: One of the big challenges facing EDA companies is explaining to customers what's possible, how to streamline their designs, and what can be accomplished at what level of risk. Semiconductor Engineering sat down to talk about how relationships are fundamentally changing between EDA companies and their customers Michal Siwinski, chief marketing officer at Arteris; Chris Muet... » read more

Verifying A RISC-V Processor

By Ed Sperling - 17 Oct, 2023 - Comments: 0

Verifying an SoC is very different than verifying a processor due to the huge state space in the processor. In addition to the tools needed for an SoC, additional tools are required for a step and compare environment. Larry Lapides, vice president at Imperas, talks about the need to verify asynchronous events like interrupts, how to compare a reference model to RTL, and the need for both hardwa... » read more

Software-Hardware Co-Design Becomes Real

By Brian Bailey - 27 Sep, 2021 - Comments: 1

For the past 20 years, the industry has sought to deploy hardware/software co-design concepts. While it is making progress, software/hardware co-design appears to have a much brighter future. In order to understand the distinction between the two approaches, it is important to define some of the basics. Hardware/software co-design is essentially a bottom-up process, where hardware is deve... » read more

SoC Co-Emulation Using Zynq Boards

By Michelle Mata - 27 Feb, 2020 - Comments: 0

Have you ever worked on a group project where you had to combine your work with that of a colleague of a different engineering discipline but the absence of an efficient means of doing so affected the project’s overall outcome? Well, for software and hardware engineers developing an SoC, the merging of their respective engineering efforts for verification purposes is a big challenge. Early... » read more

Building Your First Chip For Artificial Intelligence? Read This First

By Ron Lowman - 13 Jun, 2019 - Comments: 0

As artificial intelligence (AI) capabilities enter new markets, the IP selected for integration provides the critical components of the AI SoC. But beyond the IP, designers are finding a clear advantage in leveraging AI expertise, services, and tools to ensure the design is delivered on time, with a high level of quality and value to the end customer for new and innovative applications. Over... » read more

Will Top-Down Hardware/Software Co-Design Ever Happen?

By Frank Schirrmeister - 31 Jan, 2019 - Comments: 0

Hardware/software co-design has been talked about, and predicted to be a problem, for at least two decades now. Why has the hardware/software development world not come to an end? In 1999, Wilf Corrigan—LSI Logic’s CEO at the time—said that the most pressing need for new EDA tools was a better methodology that would “allow software developers to begin software verification more near the... » read more

Supporting CPUs Plus FPGAs (Part 1)

By Brian Bailey - 27 Mar, 2017 - Comments: 3

While it has been possible to pair a CPU and FPGA for quite some time, two things have changed recently. First, the industry has reduced the latency of the connection between them and second, we now appear to have the killer app for this combination. Semiconductor Engineering sat down to discuss these changes and the state of the tool chain to support this combination, with Kent Orthner, system... » read more

Cars, Security, And HW-SW Co-Design

By Jeff Dorsch - 07 Jul, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss parallel hardware/software design with Johannes Stahl, director of product marketing, prototyping and FPGA, [getentity id="22035" e_name="Synopsys"]; [getperson id="11411" comment="Bill Neifert"], director of models technology, [getentity id="22186" comment="ARM"]; Hemant Kumar, director of ASIC design, Nvidia; and Scott Constable, senior member of ... » read more

The Power Of Software

By Ann Mutschler - 10 Dec, 2015 - Comments: 0

There is no argument about the increasing importance of software in system designs today, given the intimate and integral role it plays in directing the very hardware it is co-designed with. There is also a very good case for certain kinds of software that lend themselves more to certain types of processors. This, of course, depends on what is meant by the type of processor, asserted Coli... » read more

Are Models Holding Back New Methodologies?

By Brian Bailey - 30 Oct, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="101" kc_name="modeling"] at abstractions above [getkc id="49" kc_name="RTL"], a factor which has delayed adoption of [getkc id="104" kn_name="virtual prototypes"] and the proliferation of system-level design and hardware/software codesign. Taking part in the discussion were Frank Schirrmeister, group director... » read more

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Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: hardware/software co-design