Cybersecurity Risks Of Automotive OTA

By John Koon - 01 Dec, 2022 - Comments: 0

Modern vehicles increasingly resemble supercomputers on wheels, with many electronic control units (ECUs) networked together as increasingly sophisticated software is installed and updated. Similar to smartphones, vehicle OEMs will contact vehicle owners remotely about operating system updates that add new features and/or fixes, as well as software bugs and vulnerabilities. But all of this h... » read more

Carmakers To Chipmakers: Where’s The Data?

By Ed Sperling And Susan Rambo - 24 Oct, 2018 - Comments: 0

The integration of electronics into increasingly autonomous vehicles isn't going nearly as smoothly as the marketing literature suggests. In fact, it could take years before some of these discrepancies are resolved. The push toward full autonomy certainly hasn't slowed down, but carmakers and the electronics industry are approaching that goal from very different vantage points. Carmakers and... » read more

Faster Commoditization In Cars

By Ann Mutschler - 02 Nov, 2017 - Comments: 0

Sensors are at the heart of assisted and autonomous driving, but even before these devices hit the road the average selling prices of these components will have to fall far enough to be affordable to a mass audience. Achieving economies of scale is what has made the semiconductor industry successful over the past half century. It has enabled semiconductors to proliferate and for electronics ... » read more

Manufacturing Bits: Nov. 11

By Mark LaPedus - 11 Nov, 2014 - Comments: 0

Plastic smartwatch displays LG Display has begun production of what the company claims is the world’s first circular plastic OLED (P-OLED) display. The P-OLED is the display for the company’s new smartwatch, the LG G Watch R. Based on the Android Wear operating system, the smartwatch is powered by Qualcomm’s 1.2-GHz Snapdragon 400 processor. It also has 4GB of storage and 512MB of RAM... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Cybersecurity Risks Of Automotive OTA

Carmakers To Chipmakers: Where’s The Data?

Faster Commoditization In Cars

Manufacturing Bits: Nov. 11

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