New Packaging Roadmap


Historically, the electronics industry has drawn sharp distinctions between the integrated circuit chip, the package that protects it from the environment, and the board that connects it to other devices in a complete system. The circuit and systems worlds have been largely isolated from each other, using different tools, different processes, and different metrics for success. While integrated ... » read more

ECTC Packaging Trends


At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies. The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more