中文 English

EUV Pellicles Finally Ready


After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Manufacturing Bits: March 8


Two-beam EUV lithography At the recent SPIE Advanced Lithography conference, Nikon gave a presentation on a two-beam extreme ultraviolet (EUV) lithography technology. Still in the conceptual phase, Nikon’s so-called EUV Projection Optical Wafer Exposure Ruling Machine, or EUV Power Machine, is designed for the 1nm node or so. The proposed system has a minimum resolution of 10nm for lines ... » read more

AI And High-NA EUV At 3/2/1nm


Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. To vie... » read more

EUV Challenges And Unknowns At 3nm and Below


The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

Challenges Linger For EUV


Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. To vie... » read more

New Architectures, Much Faster Chips


The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

EUV’s Uncertain Future At 3nm And Below


Several foundries have moved extreme ultraviolet (EUV) lithography into production at both 7nm and 5nm, but now the industry is preparing for the next phase of the technology at 3nm and beyond. In R&D, the industry is developing new EUV scanners, masks and resists for the next nodes. 3nm is slated for 2022, followed by 2nm a year or two later. Nonetheless, it will require massive funding... » read more

Challenges In Stacking, Shrinking And Inspecting Next-Gen Chips


Rick Gottscho, CTO of Lam Research, sat down with Semiconductor Engineering to discuss memory and equipment scaling, new market demands, and changes in manufacturing being driven by cost, new technologies, and the application of machine learning. What follows are excerpts of that conversation. SE: We have a lot of different memory technologies coming to market. What's the impact of that? ... » read more

Making Chips At 3nm And Beyond


Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

Improving EUV Process Efficiency


The semiconductor industry is rethinking the manufacturing flow for extreme ultraviolet (EUV) lithography in an effort to improve the overall process and reduce waste in the fab. Vendors currently are developing new and potentially breakthrough fab materials and equipment. Those technologies are still in R&D and have yet to be proven. But if they work as planned, they could boost the flo... » read more

← Older posts