How To Raise Reliability, Availability, And Serviceability Levels For HPC SoCs

By Charlie Matar, Rita Horner, and Pawini Mahajan While once the domain of large data centers and supercomputers, high-performance computing (HPC) has become rather ubiquitous and, in some cases, essential in our everyday lives. Because of this, reliability, availability, and serviceability, or RAS, is a concept that more HPC SoC designers should familiarize themselves with. RAS may sound... » read more

Mitigating Silent Data Corruptions in High Performance Computing

A new technical paper titled "Mitigating silent data corruptions in HPC applications across multiple program inputs" was published by researchers at University of Iowa, Baidu Security, and Argonne National Lab. The paper was a Best Paper finalist at SC22. The researchers "propose MinpSID, an automated SID framework that automatically identifies and re-prioritizes incubative instructions in a... » read more

The Path To Known Good Interconnects

Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and predictable ways is becoming a challenge as the number of options continues to grow. More possibilities also bring more potential interac... » read more

RISC-V decoupled Vector Processing Unit (VPU) For HPC

A technical paper titled "Vitruvius+: An Area-Efficient RISC-V Decoupled Vector Coprocessor for High Performance Computing Applications" was published by researchers at Barcelona Supercomputing Center, Spain. "The maturity level of RISC-V and the availability of domain-specific instruction set extensions, like vector processing, make RISC-V a good candidate for supporting the integration of ... » read more

Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton)

A technical paper titled "A 100-Gb/s PAM4 Optical Transmitter in a 3-D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators" was published by researchers at CalTech and University of Southampton. "The resulting optimized interface between the two chips allows them to transmit 100 gigabits of data per second while producing just 2.4 pico-Joules per transmitted bit. This improves th... » read more

The Data Center Journey, From Central Utility To Center Of The Universe

High-performance computing (HPC) has taken on many meanings over the years. The primary goal of HPC is to provide the needed computational power to run a data center – a utilitarian facility dedicated to storing, processing, and distributing data. The beginning of HPC Historically, the data being processed was the output of business operations for a given organization. Transactions, custome... » read more

A New Era For HPC-Driven Engineering Simulation

Market pressure and technological advancements have rapidly changed the way engineers work. Design engineers increasingly work with larger and more complex models, must conduct more frequent simulation analysis, and iterate more rapidly. Compute constraints, however, often result in engineers limiting model sizes and simulation fidelity, or relying on lengthy, overnight simulation runs. ... » read more

The Value Of High-Performance Computing For Simulation

This white paper breaks down the costs and time savings associated with implementing high-performance computing technology. High-performance computing (HPC) is an enormous part of the present and future of engineering simulation. HPC allows best-in-class companies to gain high-fidelity insight into product behavior, insight that cannot be obtained without the detailed simulation models – i... » read more

How New Storage Technologies Enhance HPC Systems

High-performance computing (HPC) has historically been available primarily to governments, research institutions, and a few very large corporations for modeling, simulation, and forecasting applications. As HPC platforms are being deployed in the cloud for shared services, high-performance computing is becoming much more accessible, and its use is benefiting organizations of all sizes. Increasi... » read more

Center Stage: The Time For Hybrid Bonding Has Arrived

When the subject of hybrid bonding is brought up in the industry, the focus is often on how this technique is used to manufacture CMOS image sensors (CIS), an essential device for today’s digital cameras, particularly those found in smartphones. As such, CIS is a common touchpoint given the ubiquity of mobile phones, whether you hold a product from Apple, Samsung, or Huawei in your hands. ... » read more

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