tag: Hitachi High-Tech

3D Metrology Meets Its Match In 3D Chips And Packages
By Laura Peters - 11 Jun, 2024 - Comments: 0

The pace of innovation in 3D device structures and packages is accelerating rapidly, driving the need for precise measurement and control of feature height to ensure these devices are reliable and perform as expected throughout their lifetimes. Expansion along the z axis is already well underway. One need look no further than the staircase-like 3D NAND stacks that rise like skyscrapers to p... » read more

New Insights Into IC Process Defectivity
By Laura Peters - 07 Nov, 2023 - Comments: 1

Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be problematic at each new node, but now they are persistent problems at several nodes and in advanced packaging, where there may be a mix of different technologies. In addition, there are more proc... » read more

Metrology Strategies For 2nm Processes
By Laura Peters - 07 Mar, 2023 - Comments: 3

Metrology and wafer inspection processes are changing to keep up with evolving and new device applications. While fab floors still have plenty of OCD tools, ellipsometers, and CD-SEMs, new systems are taking on the increasingly 3D nature of structures and the new materials they incorporate. For instance, processes like hybrid bonding, 3D NAND flash devices, and nanosheet FETs are pushing the bo... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 22 Dec, 2022 - Comments: 0

SEMI , SEMI Europe and European Commission representatives, in consultation with semiconductor industry stakeholders, proposed initiatives to overcome the skills shortage in Europe’s microelectronics industry: Create an industry image campaign to raise public awareness on how technology is shaping the future, and how workers can establish careers in the semiconductor industry. Remove ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Jul, 2021 - Comments: 0

Chipmakers The chip industry is buzzing over a Wall Street Journal report that Intel is in talks to buy GlobalFoundries (GF) for $30 billion. In March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Intel planned to jumpstart its foundry business within its own fabs. But it... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 May, 2020 - Comments: 0

Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about TSMC’s recent announcement to build a fab in Ariz. As reported, TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, w... » read more

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