tag: Hitachi

Week In Review: Design, Low Power
By Jesse Allen - 06 Jul, 2018 - Comments: 0

CAST debuted an IP subsystem implementing the latest IEEE standards for Time Sensitive Networking (TSN) over Ethernet. The TSN_CTRL Subsystem combines three IP cores, a time synchronizer, traffic shaper, and Ethernet MAC. It implements a hardware subsystem that operates without software assistance once programmed. The IP communicates timing information to the system, and allows the system to de... » read more

The Road To Autonomy
By Jeff Dorsch - 01 Feb, 2018 - Comments: 0

Visions of autonomous driving were everywhere at CES 2018 in Las Vegas and the North American International Auto Show in Detroit. Still, while there is progress in the technology, it will be years before the average motorist can get a fully autonomous vehicle. Advanced driver-assistance systems are gaining in complexity and scope, representing steps toward automated driving. At CES 2018, ... » read more

Manufacturing Bits: Jan. 2
By Mark LaPedus - 02 Jan, 2018 - Comments: 0

World’s coldest chip Using a network of nuclear refrigerators, the University of Basel and others claim to have set the record for the world’s coldest chip. Researchers have cooled a chip to a temperature lower than 3 millikelvin. A millikelvin is one thousandth of a kelvin. Absolute zero is 0 kelvin or minus 273.15 °C. In the experiment, researchers used a chip that includes a Coulomb... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Dec, 2017 - Comments: 0

Chipmakers, LCD suppliers United Microelectronics Corp. (UMC) has announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The 40nm SST process features a >20% reduction in eFlash cell size and 20-30% macro area over UMC’s 55nm SST technology. Toshiba Electronic Devices & Storage has s... » read more

Shortages Hit Packaging Biz
By Mark LaPedus - 11 Dec, 2017 - Comments: 1

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

The Week In Review: IoT
By Jeff Dorsch - 29 Sep, 2017 - Comments: 0

Connectivity Sigfox this week held the first annual Sigfox World IoT Expo in Prague, Czech Republic, bringing together network operators, business partners, and industry professionals. The company announced a number of new services for its users, including the Admiral Ivory connectivity service, which promises to make any short-range wireless device into a long-range Internet of Things device,... » read more

The Week In Review: IoT
By Jeff Dorsch - 15 Sep, 2017 - Comments: 0

Conferences Artificial intelligence, the Internet of Things, and 5G wireless communications were the talk of this week’s Mobile World Congress Americas event at the Moscone Center in San Francisco. Interesting topics, to be sure, yet they were eclipsed by a panel discussion on Wednesday afternoon about a matter of life or death. At a program put together by 151 Advisors, one of the panel ses... » read more

Fractilia: Pattern Roughness Metrology
By Mark LaPedus - 21 Feb, 2017 - Comments: 1

A new startup has emerged and unveiled a technology that addresses one of the bigger but less understood problems in advanced lithography--pattern roughness. The startup, called Fractilia, is a software-based metrology tool that analyzes the CD-SEM images of pattern roughness on a wafer. Fractilia, a self-funded startup, is led by Chris Mack and Ed Charrier. Mack, known as the gentleman sc... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 Nov, 2016 - Comments: 0

Samsung Austin Semiconductor plans to invest more than $1 billion in its fab in Austin, Texas. Today, the fab continues to ramp up the company’s 14nm finFET technology. At the same time, Samsung is expanding its advanced finFET foundry process technology offerings with its fourth-generation 14nm process (14LPU) and its third-generation 10nm technology (10LPU). Graphcore is developing a so-... » read more

The Week In Review: IoT
By Jeff Dorsch - 23 Sep, 2016 - Comments: 0

Security The Industrial Internet Consortium this week unveiled the Industrial Internet Security Framework, a set of specifications for connected health-care devices and hospitals, intelligent transportation, smart electrical grids, smart factories, and other cyber-physical systems in the Internet of Things. AT&T, Fujitsu, Hitachi, Infineon Technologies, Intel, Microsoft, and Symantec are among... » read more

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