Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan Japan's Rapidus and the University of Tokyo are teaming up with France's Leti to meet its previously announced mass production goal of 2nm chips by 2027, and chips in the 1nm range in the 2030s. Rapidus was formed in 2022 with the support of eight Japanese companies — Sony, Kioxia, Denso, NEC, NTT, SoftBank, Toyota, and Mitsubishi's banking arm, ... » read more

Placement And CTS Techniques For High-Performance Computing Designs


This paper discusses the challenges of designing high-performance computing (HPC) integrated circuits (ICs) to achieve maximum performance. The design process for HPC ICs has become more complex with each new process technology, requiring new architectures and transistors. We highlight how the Siemens Aprisa digital implementation solution can solve placement and clock tree challenges in HPC de... » read more

Hardware Security for Silicon Photonic-Based AI Accelerators


A technical paper titled “Integrated Photonic AI Accelerators under Hardware Security Attacks: Impacts and Countermeasures” was published by researchers at Ecole Polytechnique de Montreal and Colorado State University. Abstract: "Integrated photonics based on silicon photonics platform is driving several application domains, from enabling ultra-fast chip-scale communication in high-perfor... » read more

Hardware-Assisted Malware Analysis


A technical paper titled "On the Feasibility of Malware Unpacking via Hardware-assisted Loop Profiling" was published by researches at Shandong University & Hubei Normal University, Tulane University and University of Texas at Arlington.  This paper was included at the recent 32nd USENIX Security Symposium. Abstract "Hardware Performance Counters (HPCs) are built-in registers of modern... » read more

Placement And CTS Techniques For High-Performance Computing Designs


This paper discusses the challenges of designing high-performance computing (HPC) integrated circuits (ICs) to achieve maximum performance. The design process for HPC ICs has become more complex with each new process technology, requiring new architectures and transistors. We highlight how the Siemens Aprisa digital implementation solution can solve placement and clock tree challenges in HPC de... » read more

Improved Arm Server Price-Performance For HPC


The availability of Amazon EC2 Hpc7g instances with the AWS Graviton3E and Elastic Fabric Adapter (EFA) is opening new opportunities in key areas: Manufacturing Aerospace Automotive engineering Weather prediction The new AWS EC2 instance types have AWS Graviton3E’s 64 Arm Neoverse V1 cores and 8 channels of DDR5 memory. This is alongside the AWS Nitro v5 card with EFA deliver... » read more

Study On HPC And Cloud Computing For Engineering Simulation


In engineering applications, cloud computing can provide the on-demand compute power needed to run increasingly more complex simulations on a more frequent basis throughout the design cycle. Simulation plays an increasingly important role in the development of disruptive new technologies and systems such as autonomous vehicles, digital manufacturing, next-generation aircraft, and more. Rapid, h... » read more

Redox-Based Ionic Devices For High-Performance Neuromorphic Computing


A technical paper titled "A Redox-Based Ion-Gating Reservoir, Utilizing Double Reservoir States in Drain and Gate Nonlinear Responses" was published by researchers at National Institute for Materials Science (NIMS) and Tokyo University of Science. Abstract: "Herein, physical reservoir computing with a redox-based ion-gating reservoir (redox-IGR) comprising LixWO3 thin film and lithium-ion co... » read more

Tools for Co-Designing HPC Systems Using RISC-V As A Demonstrator


A technical paper titled “Software Development Vehicles to enable extended and early co-design: a RISC-V and HPC case of study” was published by researchers at Barcelona Supercomputing Center and FORTH. Abstract: "Prototyping HPC systems with low-to-mid technology readiness level (TRL) systems is critical for providing feedback to hardware designers, the system software team (e.g., co... » read more

Top500: Frontier Is Still On Top


The latest versions of the Top500 and Green500 lists were just released on May 22, 2023. The last time that I wrote about the Green500, a Chinese machine, NRCPC’s Sunway TaihuLight, was sitting at the top of the Top500 list. It’s been a while since I last wrote about these lists and it’s interesting to look back at the leap in performance and energy efficiency over the past 7 years. ... » read more

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