tag: HPC

Getting Optimal PPA For HPC & AI Applications With Foundation IP
By Andrew Appleby - 11 Jan, 2024 - Comments: 0

By Andrew Appleby, Xiaorui Hu, and Bhavana Chaurasia The demand for application-specific system-on-chips (SoCs) for compute applications is ever-increasing. Today, the diversity of requirements means there is a need for a rich set of compute solutions in a wide range of process technologies. The resulting products may have very different but demanding power, performance, and area (PPA) requi... » read more

2023: A Good Year For Semiconductors
By Brian Bailey - 21 Dec, 2023 - Comments: 0

Looking back, 2023 has had more than its fair share of surprises, but who were the winners and losers? The good news is that by the end of the year, almost everyone was happy. That is not how we exited 2022, where there was overcapacity, inventories had built up in many parts of the industry, and few sectors — apart from data centers — were seeing much growth. The supposed new leaders we... » read more

The Journey To Exascale Computing And Beyond
By Steven Woo - 14 Dec, 2023 - Comments: 0

High performance computing witnessed one of its most ambitious leaps forward with the development of the US supercomputer “Frontier.” As Scott Atchley from Oak Ridge National Laboratory discussed at Supercomputing 23 (SC23) in Denver last month, the Frontier had the ambitious goal of achieving performance levels 1000 times higher than the petascale systems that preceded it, while also stayi... » read more

Chip Industry Week In Review
By The SE Staff - 17 Nov, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Japan's Rapidus and the University of Tokyo are teaming up with France's Leti to meet its previously announced mass production goal of 2nm chips by 2027, and chips in the 1nm range in the 2030s. Rapidus was formed in 2022 with the support of eight Japanese companies — Sony, Kioxia, Denso, NEC, NTT, SoftBank, Toyota, and Mitsubishi's banking arm, ... » read more

Placement And CTS Techniques For High-Performance Computing Designs
By Siemens EDA - 09 Nov, 2023 - Comments: 0

This paper discusses the challenges of designing high-performance computing (HPC) integrated circuits (ICs) to achieve maximum performance. The design process for HPC ICs has become more complex with each new process technology, requiring new architectures and transistors. We highlight how the Siemens Aprisa digital implementation solution can solve placement and clock tree challenges in HPC de... » read more

Hardware Security for Silicon Photonic-Based AI Accelerators
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “Integrated Photonic AI Accelerators under Hardware Security Attacks: Impacts and Countermeasures” was published by researchers at Ecole Polytechnique de Montreal and Colorado State University. Abstract: "Integrated photonics based on silicon photonics platform is driving several application domains, from enabling ultra-fast chip-scale communication in high-perfor... » read more

Hardware-Assisted Malware Analysis
By Technical Paper Link - 25 Aug, 2023 - Comments: 0

A technical paper titled "On the Feasibility of Malware Unpacking via Hardware-assisted Loop Profiling" was published by researches at Shandong University & Hubei Normal University, Tulane University and University of Texas at Arlington.  This paper was included at the recent 32nd USENIX Security Symposium. Abstract "Hardware Performance Counters (HPCs) are built-in registers of modern... » read more

Placement And CTS Techniques For High-Performance Computing Designs
By Siemens EDA - 26 Jul, 2023 - Comments: 0

This paper discusses the challenges of designing high-performance computing (HPC) integrated circuits (ICs) to achieve maximum performance. The design process for HPC ICs has become more complex with each new process technology, requiring new architectures and transistors. We highlight how the Siemens Aprisa digital implementation solution can solve placement and clock tree challenges in HPC de... » read more

Improved Arm Server Price-Performance For HPC
By David Lecomber - 20 Jul, 2023 - Comments: 0

The availability of Amazon EC2 Hpc7g instances with the AWS Graviton3E and Elastic Fabric Adapter (EFA) is opening new opportunities in key areas: Manufacturing Aerospace Automotive engineering Weather prediction The new AWS EC2 instance types have AWS Graviton3E’s 64 Arm Neoverse V1 cores and 8 channels of DDR5 memory. This is alongside the AWS Nitro v5 card with EFA deliver... » read more

Study On HPC And Cloud Computing For Engineering Simulation
By Ansys - 19 Jul, 2023 - Comments: 0

In engineering applications, cloud computing can provide the on-demand compute power needed to run increasingly more complex simulations on a more frequent basis throughout the design cycle. Simulation plays an increasingly important role in the development of disruptive new technologies and systems such as autonomous vehicles, digital manufacturing, next-generation aircraft, and more. Rapid, h... » read more

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