Are Sustainability And Safety Gen Z’s Top Requirements In 2031?

By Frank Schirrmeister - 24 Feb, 2022 - Comments: 0

This blog is my 125th on the "Frankly Speaking" channel on SemiEngineering. A big thanks to Ed and his team for a great run and for putting up with my musings! I had started work-related blogging back in 2008, more company-specific, and some of these have since then vanished from the internet. Who would have thought! For this anniversary, I am looking forward ten years to 2031 and how generatio... » read more

Three Technologies Enabling The Next Decade Of Hyperconnectivity

By Frank Schirrmeister - 27 Jan, 2022 - Comments: 0

As it has become a tradition in my 15 years of blogging, January is a month of both reflection and outlook. At the beginning of 2022, I am excited that key themes from 5 and 10 years ago—3D integration, artificial intelligence and machine learning (AI/ML), and ubiquitous needs for more connectivity driving 4G and 5G networks—clearly have exceeded expectations and forecasts from that time. L... » read more

Sustainability, Ecosystems, And Consumer Requirements In 2022

By Frank Schirrmeister - 22 Dec, 2021 - Comments: 0

Last December, my 2021 outlook focused on "industry transformations" across different verticals. I had referenced a lot of the ongoing transformations in hyperscale computing, aerospace/defense, automotive, and healthcare. 2021 didn't disappoint—most of what I discussed further accelerated pace. For instance, pretty much no booth felt complete at the annual Army AUSA event if they were not... » read more

Microelectronics And The AI Revolution

By Frank Schirrmeister - 23 Sep, 2021 - Comments: 0

It is no secret that artificial intelligence and machine learning (AI/ML) are critical drivers for growth in electronics, and particularly, for semiconductors. The recent AI Hardware Summit showcased trends in AI/ML, both in enabling and using it in various application domains, including EDA. As part of the summit, Imec had organized a panel on “Advanced Microelectronics Technologies Driving ... » read more

Designing High-Performance Electronics For Today’s Hyperconnected Systems

By Cadence - 08 Sep, 2021 - Comments: 0

With the rapid evolution of hyperconnected devices that are managing constant and near-instantaneous data from anywhere and at any time, designing at each new technology node must overcome design and integration complexity. To do so requires automated solutions to process the scale of modern designs. Cadence system analysis solutions operate on unimaginably huge amounts of data, scaling algorit... » read more

Hyperconnectivity’s Impact On Consumers

By Paul McLellan - 08 Jul, 2021 - Comments: 0

Do you know what hyperconnectivity is? It is already affecting you, whether you know it or not. Hyperscalers are the companies like AWS, Google, and Microsoft that build and run those enormous (aka hyperscale) data centers. If you are a designer and use the cloud, then you have at least a vague idea of what data centers are being used to handle your design. But even if you are the generic perso... » read more

Hyperconnectivity And The Path To 6G

By Frank Schirrmeister - 22 Apr, 2021 - Comments: 0

Some may view the recent uptick in the news about next-generation wireless networking, specifically 6G, with some healthy skepticism as 5G is “just rolling out.” But when looking at the timelines, it becomes clear why 6G is critical and is also excellent news for electronics, and by extension, the design of semiconductors and systems. The same key elements that transformed the data center t... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.