tag: IBM

DRAM, 3D NAND Face New Challenges
By Mark LaPedus - 21 Sep, 2020 - Comments: 1

It’s been a topsy-turvy period for the memory market, and it's not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In addition, the 3D NAND market is moving toward a new technology generation, but some are enc... » read more

New Architectures, Much Faster Chips
By Ed Sperling and Ann Mutschler - 31 Aug, 2020 - Comments: 0

The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Aug, 2020 - Comments: 0

Packaging Chunghwa Telecom, ASE and Qualcomm Technologies have announced plans to jointly build Taiwan's first 5G mmWave enterprise private network smart factory. As part of the plan, ASE is deploying a series of smart factory technologies within its existing Kaohsiung, Taiwan-based campus. This includes the deployment of 5G mmWave network cells in the Kaohsiung campus. Qualcomm will be ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 21 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT SEMI formed a new standards committee to develop global standards for flexible hybrid electronics (FHE). The SEMI Standards Flexible Hybrid Electronics Global Technical Committee will develop FHE standards for design, materials, manufacturing, packaging and systems and to drive industry growth. IPC is also working on FHE standards as an industry s... » read more

Manufacturing Bits: Aug. 18
By Mark LaPedus - 18 Aug, 2020 - Comments: 0

Quantum Internet The U.S. Department of Energy (DOE) recently unveiled a strategy to develop a quantum Internet in the United States. DOE’s 17 National Laboratories will serve as the backbone of the quantum Internet, which will rely on the laws of quantum mechanics to control and transmit information over a network. Currently in its initial stages of development, the quantum Internet coul... » read more

The Next Leap
By Ed Sperling - 14 Aug, 2020 - Comments: 0

Some interesting new technologies are about to go on display. Chipmakers and systems companies have been working on quantum computing, photonics, and specialized AI processors, for the past several years, and those efforts are beginning to gain momentum. The goal is no longer a doubling of performance and power. It's now orders of magnitude improvement, and next week's Hot Chips conference i... » read more

Atomic Layer Etch Expands To New Markets
By Mark LaPedus - 16 Jul, 2020 - Comments: 0

The semiconductor industry is developing the next wave of applications for atomic layer etch (ALE), hoping to get a foothold in some new and emerging markets. ALE, a next-generation etch technology that removes materials at the atomic scale, is one of several tools used to process advanced devices in a fab. ALE moved into production for select applications around 2016, although the technolog... » read more

Power Impact At The Physical Layer Causes Downstream Effects
By Ann Mutschler - 09 Jul, 2020 - Comments: 0

Data movement is rapidly emerging as one of the top design challenges, and it is being complicated by new chip architectures and physical effects caused by increasing density at advanced nodes and in multi-chip systems. Until the introduction of the latest revs of high-bandwidth memory, as well as GDDR6, memory was considered the next big bottleneck. But other compute bottlenecks have been e... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Jul, 2020 - Comments: 0

The American Foundries Act, a bipartisan initiative to revive U.S. leadership in the global microelectronics sector, was announced by U.S. Democratic Senator Chuck Schumer from New York. “The economic and national security risks posed by relying too heavily on foreign semiconductor suppliers cannot be ignored, and Upstate New York, which has a robust semiconductor sector, is the perfect place... » read more

Are Better Machine Training Approaches Ahead?
By Bryon Moyer - 01 Jul, 2020 - Comments: 1

We live in a time of unparalleled use of machine learning (ML), but it relies on one approach to training the models that are implemented in artificial neural networks (ANNs) — so named because they’re not neuromorphic. But other training approaches, some of which are more biomimetic than others, are being developed. The big question remains whether any of them will become commercially viab... » read more

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