tag: IBM

Chip Industry Week In Review
By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Chip Industry Week In Review
By The SE Staff - 13 Oct, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

CXL: The Future Of Memory Interconnect?
By Karen Heyman - 12 Oct, 2023 - Comments: 1

Momentum for sharing memory resources between processor cores is growing inside of data centers, where the explosion in data is driving the need to be able to scale memory up and down in a way that roughly mirrors how processors are used today. A year after the CXL Consortium and JEDEC signed a memorandum of understanding (MOU) to formalize collaboration between the two organizations, suppor... » read more

Chip Industry Week In Review
By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

IBM’s Energy-Efficient NorthPole AI Unit
By Barry Pangrle - 28 Sep, 2023 - Comments: 0

At this point it is well known that from an energy efficiency standpoint, the biggest bang for the back is to be found at the highest levels of abstraction. Fitting the right architecture to the task at hand i.e., an application specific architecture, will lead to benefits that are hard or impossible to claw back later in the design and implementation flow.  With the huge increase in the inter... » read more

ReRAM Seeks To Replace NOR
By Karen Heyman - 25 Sep, 2023 - Comments: 0

Resistive RAM is gaining renewed attention as demand for faster and cheaper non-volatile memory alternatives continues to grow, particularly in applications such as automotive. Embedded flash has long left designers wishing for better write speeds and lower energy consumption, but as the leading edge of that technology shrunk to 28nm, another problem arose. Manufacturing flash memory at thos... » read more

The Race Toward Quantum Advantage
By Brian Bailey - 14 Sep, 2023 - Comments: 0

Quantum computing has yet to show an advantage over conventional computing, but huge sums of money are betting it will. So far that hasn't happened. Early quantum computers were created in the mid-1990s after mathematicians had demonstrated the effectiveness of applying quantum approaches to some problems. At that stage they were simulated using conventional computing, but it started the rac... » read more

Sweeping Changes For Leading-Edge Chip Architectures
By Ed Sperling - 08 Sep, 2023 - Comments: 0

Chipmakers are utilizing both evolutionary and revolutionary technologies to achieve orders of magnitude improvements in performance at the same or lower power, signaling a fundamental shift from manufacturing-driven designs to those driven by semiconductor architects. In the past, most chips contained one or two leading-edge technologies, mostly to keep pace with the expected improvements i... » read more

Week In Review: Design, Low Power
By Linda Christensen - 25 Aug, 2023 - Comments: 0

Arm filed its registration statement for a highly anticipated IPO. Chip industry heavyweights Apple, Samsung, NVIDIA, and Intel are all expected to invest. Find the SEC filing here. Taiwan’s National Science and Technology Council (NSTC) laid out a 10-year initiative to bolster its IC design market share to 40% worldwide by 2033, with the first year’s budget of US $376 million. The sh... » read more

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