Is The 2.5D Supply Chain Ready?


A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Pick A Number


For the past two years there was some mumbling that 16/14nm would be short-lived, and that 10nm would be the place that foundries would invest heavily. Now the buzz is that 10nm may be skipped entirely and the next node will be 7nm. After all, 10nm is really only a half-node. Or is it? The answer depends on who's defining 10nm. The 16/14nm node is based on a 20nm back-end-of-line process, un... » read more

New Metrics For The Cloud


Data centers are beginning to adjust their definition of what makes one server better than another. Rather than comparing benchmarked performance of general-purpose servers, they are adding a new level of granularity based upon what kind of chips work best for certain operations or applications. Those decisions increasingly include everything from the level of redundancy in compute operations, ... » read more

Making Hardware Design More Agile


Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

What Is ‘Digital’?


I saw a LinkedIn article with this title a couple of weeks ago and was curious. Do we not know what digital is and do we need to question it? When I read the first line I was very surprised and somewhat confused. Ved Sen, the author said that, “Despite working in the digital space for years, now I was quite stumped a few weeks ago when I was asked to define it.” Why would digital be so d... » read more

2.5D Creeps Into SoC Designs


A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

Making Hardware Design More Agile


Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

Multiple Lithography Options Still Remain in Play


The throughput and uptime of EUV, and the overlay accuracy of 193nm immersion lithography, continue to steadily improve, though neither is yet ready for 10nm production, according to speakers at SEMICON West. Mike Lercel, ASML director, Product Marketing, reported several EUV tool sites achieved 70 percent uptime for more than a week, and one customer site had done so for more than four ... » read more

The Next Big Things


Progress in electronics has always been about combining more functions into devices and making access to information more convenient. This is what drove the PC revolution in the 1980s, when centralized data was made available on desktops, and it's what drove the notebook PC revolution in the 1990s as computers became untethered from the desktop, as long as you could find an Ethernet connecti... » read more

Securing EDA In The Cloud


In the first part of this article, EDA’s Clouded Future, the types of application suitable for cloud-based solutions were examined and the cost benefits that could arise for both EDA suppliers and consumers. Security has stood in the way of widespread adoption, but it is a little more complex than just being concerned about a theft of sensitive design data. Security involves data protect f... » read more

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