tag: IBM

The Week In Review: Manufacturing
By Mark LaPedus - 06 Nov, 2015 - Comments: 0

China is investing billions of dollars in the IC industry and equipment sectors. The nation is also in the midst of an acquisition and an investment spree, especially in IC packaging. For example, Jiangsu Changjiang Electronics Technology (JCET), a Chinese OSAT, shook up the landscape by recently announcing a deal to acquire STATS ChipPAC for $780 million. The deal was completed in August of 20... » read more

More Choices, Less Certainty
By Ed Sperling - 04 Nov, 2015 - Comments: 3

The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

Technology Reboot Required
By Brian Bailey - 29 Oct, 2015 - Comments: 1

The International Technology Roadmap for Semiconductors (ITRS) has produced reports outlining the major obstacles the electronics industry faces for a long time now. It attempts to project, with a 15-year horizon, the problems that need to be solved in order to take advantage of the complete design and manufacturing ecosystem. From this, early research efforts can be started. This enabled the E... » read more

Increasing Challenges At Advanced Nodes
By Ed Sperling - 22 Oct, 2015 - Comments: 1

Gary Patton, chief technology officer at GlobalFoundries, sat down with Semiconductor Engineering to talk about new materials, stacked die, how far FD-SOI can be extended, and new directions for interconnects and transistors. What follows are excerpts of that conversation. SE: Where do you see problems at future nodes? Patton: At the device level, we have to be able to pattern these thing... » read more

What China Is Planning
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

Manufacturing Of Next-Generation Channel Materials
By Michael Watts - 05 Oct, 2015 - Comments: 0

One of the many challenges for the IC developers is to change the channel material to increase transistor mobility. But what about manufacturing? Can LED-style epitaxy be migrated to high-volume silicon manufacturing? “The use of Ge and InGaAs quantum wells is an extension of the current strained Si strategy," said Aaron Thean, vice president of process technologies and director of the log... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Pick A Number
By Ed Sperling - 24 Sep, 2015 - Comments: 0

For the past two years there was some mumbling that 16/14nm would be short-lived, and that 10nm would be the place that foundries would invest heavily. Now the buzz is that 10nm may be skipped entirely and the next node will be 7nm. After all, 10nm is really only a half-node. Or is it? The answer depends on who's defining 10nm. The 16/14nm node is based on a 20nm back-end-of-line process, un... » read more

New Metrics For The Cloud
By Ed Sperling - 10 Sep, 2015 - Comments: 0

Data centers are beginning to adjust their definition of what makes one server better than another. Rather than comparing benchmarked performance of general-purpose servers, they are adding a new level of granularity based upon what kind of chips work best for certain operations or applications. Those decisions increasingly include everything from the level of redundancy in compute operations, ... » read more

Making Hardware Design More Agile
By Ed Sperling - 31 Aug, 2015 - Comments: 1

Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

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