China Speeds Up Advanced Chip Development


China is accelerating its efforts to advance its domestic semiconductor industry, amid ongoing trade tensions with the West, in hopes of becoming more self-sufficient. The country is still behind in IC technology and is nowhere close to being self-reliant, but it is making noticeable progress. Until recently, China’s domestic chipmakers were stuck with mature foundry processes with no pres... » read more

Week In Review: Manufacturing, Test


Chipmakers Jim Keller, senior vice president in the Technology, Systems Architecture and Client Group (TSCG) and general manager of the Silicon Engineering Group (SEG) at Intel, has resigned amid a major reorganization at the company. Here's one report about the situation. Cree as well as China’s Yutong Group and StarPower are working together to accelerate the commercial adoption of sili... » read more

Week In Review: Manufacturing, Test


Fab tools and test KLA has announced the formation of a new business group for its Electronics, Packaging and Components (EPC) businesses. The new EPC group includes the ICOS, Orbotech and the SPTS Technologies organizations. The group will be headed by Oreste Donzella, KLA’s executive vice president. In 2018, KLA acquired Orbotech for $3.4 billion, a deal that included two organizations-... » read more

Latest IC Outlook: More Uncertainty


So far in 2020, it’s been a difficult period in the semiconductor industry amid the Covid-19 pandemic outbreak and other issues. And heading into the second half of 2020, the industry faces more challenges, if not uncertainty, in the market. Many segments in the semiconductor industry face some headwinds, but there might be some positive news in the equipment business. To be sure,... » read more

Week In Review: Manufacturing, Test


Chipmakers The Trump administration has held talks with Intel and TSMC to build more leading-edge fabs in the U.S., according to the Wall Street Journal and other news outlets. IC Insights has released its rankings of the top-10 chip vendors in terms of sales for the first quarter. Intel remains in first place, followed by Samsung and TSMC. The big surprise is China-based fabless IC supplie... » read more

Week In Review: Manufacturing, Test


Chipmakers Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. There are already signs that the foundries have pushed out their 3nm production schedules. So, expect 7nm and 5nm to become long-running nodes. At 3nm, Samsung and TSMC are going in different directions. Samsung is developing a gate-all-around (GAA) technology called nanosheet FETs. TSMC will e... » read more

Week In Review: Design, Low Power


Tools & IP Codasip unveiled its Codasip SweRV Core EH1 Support Package, which provides support for Western Digital's open source RISC-V-based core. The support package provides a comprehensive set of tools and components needed to design, implement, test, and write software for a SweRV Core-based SoC with support for leading EDA open and commercial flows. A free basic version is available ... » read more

Scaling CMOS Image Sensors


After a period of record growth, the CMOS image sensor market is beginning to face some new and unforeseen challenges. CMOS image sensors provide the camera functions in smartphones and other products, but now they are facing scaling and related manufacturing issues in the fab. And like all chip products, image sensors are seeing slower growth amid the coronavirus outbreak. Manufactured a... » read more

Week In Review: Manufacturing, Test


Market research The coronavirus pandemic continues to reduce the outlook for worldwide GDP as well as the electronics and IC markets. For example, IC Insights has lowered its IC forecast from 3% to minus 4% in 2020. The IC market is now expected to hit $345.8 billion in 2020, which is $39.0 billion less than the original forecast, which called for an 8% increase this year. Due to the imp... » read more

Week In Review: Manufacturing, Test


Chipmakers TrendForce has released its projected foundry rankings in terms of sales for the first quarter. TSMC is still in first place, followed by Samsung, GlobalFoundries and UMC. Samsung has been ramping up chips based on its 7nm logic process using extreme ultraviolet (EUV) lithography. Now, Samsung is ramping up its DRAM devices using EUV and plans to expand its capacity in the arena.... » read more

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