tag: IEDM

What If We Had Bi-Directional RRAM?
By Katherine Derbyshire - 15 Feb, 2018 - Comments: 0

The ideal memristor device for neuromorphic computing would have linear and symmetric resistance behavior. Resistance would both increase and decrease gradually, allowing a direct correlation between the number of programming pulses and the resistance value. Real world RRAM devices, however, generally do not have these characteristics. In filamentary RRAM devices, the RESET operation can raise ... » read more

What’s Next In Neuromorphic Computing
By Katherine Derbyshire - 15 Feb, 2018 - Comments: 2

To integrate devices into functioning systems, it's necessary to consider what those systems are actually supposed to do. Regardless of the application, [getkc id="305" kc_name="machine learning"] tasks involve a training phase and an inference phase. In the training phase, the system is presented with a large dataset and learns how to "correctly" analyze it. In supervised learning, the data... » read more

E-beam Inspection Makes Inroads
By Mark LaPedus - 18 Jan, 2018 - Comments: 4

E-beam inspection is gaining traction in critical areas in fab production as it is becoming more difficult to find tiny defects with traditional methods at advanced nodes. Applied Materials, ASML/HMI and others are developing new e-beam inspection tools and/or techniques to solve some of the more difficult defect issues in the fab. [gettech id="31057" t_name="E-beam"] inspection is one of tw... » read more

A New Memory Contender?
By Mark LaPedus - 02 Jan, 2018 - Comments: 1

Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

What the Experts Think
By Sandra Liu - 20 Dec, 2017 - Comments: 0

Coventor recently sponsored an expert panel discussion at IEDM 2017 to discuss how we might advance the semiconductor industry into the next generation of technology. The panel discussed alternative methods to solve fundamental problems of technology scaling, using advances in semiconductor architectures, patterning, metrology, advanced process control, variation reduction, co-optimization and ... » read more

What’s Next With Computing?
By Mark LaPedus - 18 Dec, 2017 - Comments: 1

At the recent IEDM conference, Jeff Welser, vice president and lab director at IBM Research Almaden, sat down to discuss artificial intelligence, machine learning, quantum computing and supercomputing with Semiconductor Engineering. Here are excerpts of that conversation. SE: Where is high-end computing going? Welser: We are seeing lots of different systems start to come up. First of all,... » read more

Manufacturing Bits: Dec. 12
By Mark LaPedus - 12 Dec, 2017 - Comments: 0

3D diodes At the recent IEEE International Electron Devices Meeting (IEDM) in San Francisco, the Ecole Polytechnique Fédérale de Lausanne (EPFL) and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) presented a paper on what they call the world’s first back-illuminated 3D-stacked, single-photon avalanche diode (SPAD) in 45nm CMOS technology. A SPAD is one type of a photodetector. These... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Dec, 2017 - Comments: 0

Fab tools and test Four former employees at Applied Materials were charged by the U.S. for allegedly trying to steal the company’s own fab tool technology designs, according to a report from Bloomberg and others. The former employees were allegedly trying to sell the technology to a Chinese startup that would compete against Applied, according to the report. The former employees--Liang C... » read more

Manufacturing Bits: Dec. 5
By Mark LaPedus - 05 Dec, 2017 - Comments: 3

Intel vs. GlobalFoundries At the IEEE International Electron Devices Meeting (IEDM) this week, GlobalFoundries and Intel will square off and present papers on their new logic processes. Intel will present more details about its previously-announced 10nm finFET technology, while GlobalFoundries will discuss its 7nm finFET process. As expected, Intel and GlobalFoundries will use 193nm immersi... » read more

Manufacturing Bits: Oct. 24
By Mark LaPedus - 24 Oct, 2017 - Comments: 0

Redefining unit measurements At a recent meeting, the International Committee for Weights and Measures (CIPM) took the next step towards the expected redefinition of four base units within the International System of Units (SI). The SI base units include the following metrics or constants--meter, kilogram, second, ampere, kelvin, mole, and the candela. Here’s the fundamental constant... » read more

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