Manufacturing Bits: June 25

By Mark LaPedus - 25 Jun, 2019 - Comments: 0

Panel-level consortium Fraunhofer is moving forward with the next phase of its consortium to develop technologies for panel-level packaging. In 2016, Fraunhofer launched the original effort, dubbed the Panel Level Packaging Consortium. The consortium, which had 17 partners, developed various equipment and materials in the arena. Several test layouts were designed for process development on ... » read more

Telle Whitney Receives IEEE Honorary Membership

By Ann Mutschler - 22 Jun, 2019 - Comments: 0

On May 17 Telle Whitney received the 2019 IEEE Honorary Membership at the 2019 IEEE Vision, Innovation, and Challenges Summit (IEEE VIC Summit) in San Diego for leadership in supporting and promoting women in technology, and for building a highly impactful global organization dedicated to this purpose. Sponsored by IEEE, the grade of Honorary Member is a significant honor bestowed by IEEE a... » read more

Manufacturing Bits: June 10

By Mark LaPedus - 10 Jun, 2019 - Comments: 1

Predicting warpage in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, there were several papers on ways to predict variation and warpage in IC packages. Advanced packages are prone to unwanted warpage during the process flow. The warpage challenges escalate as the packages become thinner. Warpage in turn can impact yields in IC packages. ... » read more

ECTC Packaging Trends

By Mark LaPedus - 10 Jun, 2019 - Comments: 0

At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies. The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more

Manufacturing Bits: June 4

By Mark LaPedus - 04 Jun, 2019 - Comments: 0

Chiplet printer A number of companies, R&D organizations and universities separately presented a slew of papers and technologies at the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas. It’s difficult to write about all of the papers at ECTC. But one paper that stood out is a prototype chiplet micro-assembly printer developed by the Palo Alto Research Cente... » read more

Focus Shifting From 2.5D To Fan-Outs For Lower Cost

By Ed Sperling - 29 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 29 Mar, 2019 - Comments: 0

Materials Wesfarmers, an Australian diversified firm, has made an unsolicited bid to acquire Lynas, one of the world’s largest suppliers of rare earths outside of China. Rare earths are chemical elements found in the Earth’s crust. They are used in cars, consumer electronics, computers, communications, clean energy and defense systems. The big market for rare earths is magnets. In semicond... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 15 Mar, 2019 - Comments: 0

Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

IoT Merging Into Data-Driven Design

By Ed Sperling and Kevin Fogarty - 10 Jan, 2019 - Comments: 0

The Internet of Things is becoming more difficult to define and utilize for an effective business strategy. While an increasing number devices send data to the cloud or some local server, so much data is being generated and moved around that new strategies are being developed to rethink what needs to be processed where. Back in 2013, when the IoT concept really began taking off, connectivity... » read more

Manufacturing Bits: Jan. 2

By Mark LaPedus - 02 Jan, 2019 - Comments: 0

Better nanowire MOSFETs At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Applied Materials presented a paper on a new and improved way to fabricate vertically stacked gate-all-around MOSFETs. More specifically, Imec and Applied reported on process improvements for a silicon nanowire MOSFET, which is integrated in a CMOS dual work function metal replacement metal ga... » read more

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Knowledge Centers
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by Ann Mutschler

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by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: IEEE

Manufacturing Bits: June 25

Telle Whitney Receives IEEE Honorary Membership

Manufacturing Bits: June 10

ECTC Packaging Trends

Manufacturing Bits: June 4

Focus Shifting From 2.5D To Fan-Outs For Lower Cost

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

IoT Merging Into Data-Driven Design

Manufacturing Bits: Jan. 2

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Knowledge Centers
Entities, people and technologies explored