tag: imec

Going On the Edge
By Mark LaPedus - 27 Jan, 2020 - Comments: 3

Emmanuel Sabonnadière, chief executive of Leti, sat down with Semiconductor Engineering to talk about artificial intelligence (AI), edge computing and chip technologies. What follows are excerpts of that conversation. SE: Where is AI going in the future? Sabonnadière: I am a strong believer that edge AI will change our lives. Today’s microelectronics are organized with 80% of things i... » read more

5/3nm Wars Begin
By Mark LaPedus - 23 Jan, 2020 - Comments: 6

Several foundries are ramping up their new 5nm processes in the market, but now customers must decide whether to design their next chips around the current transistor type or move to a different one at 3nm and beyond. The decision involves the move to extend today’s finFETs to 3nm, or to implement a new technology called gate-all-around FETs (GAA FETs) at 3nm or 2nm. An evolutionary step f... » read more

Manufacturing Bits: Dec. 16
By Mark LaPedus - 16 Dec, 2019 - Comments: 0

Imec-Leti alliance At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Leti announced plans to collaborate in select areas. The two R&D organizations plan to collaborate in two areas—artificial intelligence (AI) and quantum computing. Imec and Leti have been separately working on AI technologies based on various next-generation memory architectures. Both entitie... » read more

A Trillion Security Risks
By Yuri Nagano - 05 Dec, 2019 - Comments: 0

An explosion in IoT devices has significantly raised the security threat level for hardware and software, and it shows no sign of abating anytime soon. Sometime over the next decade the number of connected devices is expected to hit the 1 trillion mark. Expecting all of them to be secure is impossible, particularly as the attack surface widens and the attack vectors become more sophisticated... » read more

Organ-on-Chip Systems Enable Personalized Medicine
By Serena Brischetto - 21 Nov, 2019 - Comments: 0

Healthcare has traditionally focused on one-size fits-all medication to treat populations instead of tailoring treatments to individual patients. Recent advances in stem cell technology allow researchers to create disease models for personalized medicine. SEMI spoke with Thomas Pauwelyn, Postdoctoral Researcher at imec, about trends in medical technology innovation such as organ-on-chip devices... » read more

Blog Review: Nov. 20
By Jesse Allen - 20 Nov, 2019 - Comments: 0

Arm's Ben Fletcher points to research into a new low-cost alternative to through-silicon vias in 3D stacked ICs, particularly cost-sensitive IoT designs, where communication between silicon layers is completely wireless. Cadence's Paul McLellan checks in on the progress of DARPA's OpenROAD project to build a no-human-in-the-loop open source EDA flow for leading-edge nodes. Mentor's Colin ... » read more

How Secure Is Your Face?
By Yuri Nagano - 07 Nov, 2019 - Comments: 0

Biometric security, which spans everything from iris scans to fingerprint sensors, is undergoing the same kind of race against hackers as every other type of sensor. While most of these systems work well enough to identify a person, there are a number of well-known ways to defeat them. One is simply to apply newer technology to cracking algorithms used inside these devices. Improvements in p... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Oct, 2019 - Comments: 0

Fab tools A consortium of 31 companies have launched a new project, called the “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe.” The program is referred to as APPLAUSE. With a budget of 34 million euros, the project is being coordinated by ICOS, a division of KLA. “APPLAUSE will focus on advanced optics, photonics and electronics packagin... » read more

Power/Performance Bits: Sept. 24
By Jesse Allen - 24 Sep, 2019 - Comments: 0

Textiles for energy storage Scientists at RMIT University developed a way to laser print waterproof textiles with graphene supercapacitors for embedded energy storage. The process takes three minutes to create a 10x10cm patch. The electronic textile is based on nylon coated with PDMS on one side for waterproofing. The other side was paint coated with graphene oxide and a binder to form thin... » read more

The Race To Next-Gen 2.5D/3D Packages
By Mark LaPedus - 23 Sep, 2019 - Comments: 4

Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing future packages based on one emerging interconnect scheme, called copper-to-copper hybrid bonding. This technology provides a way to stack advanced dies using copper connections at the chip level,... » read more

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