Chip Industry’s Technical Paper Roundup: October 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=150 /] Related Reading Technical Paper Library home » read more

Integration Of Layered Semimetals With Conventional CMOS Platform


A technical paper titled “Layered semimetal electrodes for future heterogeneous electronics” was published by researchers at IIT Madras and Indian Institute of Science Education and Research. Abstract: "Integration of the emerging layered materials with the existing CMOS platform is a promising solution to enhance the performance and functionalities of the future CMOS based integrated cir... » read more

Manufacturing Bits: Sept. 28


Self-healing ceramics Texas A&M University has discovered a new self-healing mechanism for ceramics, a technology that could one day be used for jet engines, hypersonic aircraft and nuclear reactors. Ceramics involve various materials that are neither metallic nor organic, but rather they are crystalline and/or glassy, according to the University of Maryland. One common example is clay,... » read more

Power/Performance Bits: June 30


Tiny, solar-powered sensors Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells. Previous ultralow-power converters that used the same approach had efficiencies of only 40 or 50 percent. ... » read more