Chip Industry Technical Paper Roundup: Nov. 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=378 /]   Further Reading Chip Industry Week In Review Silicon Valley design center and NY EUV Accelerator; Siemens’ big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si-based power wafer; $100M funding for AI; trade wars escalate; earnings rep... » read more

Metamodeling Techniques for Formal Verification


A new technical paper titled "Verifying Non-friendly Formal Verification Designs: Can We Start Earlier?" was published by researchers at Universität Kaiserslautern-Landau and Infineon Technologies. Published in DVCon Europe 2024. Abstract "The design of Systems on Chips (SoCs) is becoming more and more complex due to technological advancements. Missed bugs can cause drastic failures in saf... » read more

Chip Industry Technical Paper Roundup: Oct. 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=360 /] More ReadingTechnical Paper Library home » read more

Balancing Programmability And Performance In Cars


The rate of change in the automotive industry is accelerating with the shift toward software-defined vehicles and ongoing advancements in algorithms and chip architectures. The challenge now is to figure out the best way to prevent rapid obsolescence, improve safety, and keep the cost of these changes to a minimum. Today, updatable automotive hardware is typically achieved through FPGAs, but... » read more

Chip Industry Week in Review


The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

Thermal Challenges Multiply In Automotive, Embedded Devices


Embedding chips into stacked-die assemblies is creating thermal dissipation challenges that can reduce the reliability and lifespan of these devices, a growing problem as chipmakers begin cramming chiplets into advanced packages with thinner substrates between them. In the past, nearly all of these complex designs were used in tightly controlled environments, such as a large data center, whe... » read more

Enabling The Next Generation Of Smarter Self-Navigating Robots Using Hybrid ToF Technology


Previous generations of robot vacuum cleaners have used a random pattern for cleaning that is inefficient and slow. Next-generation robots are much smarter and generate a map of the environment using sensors to localize themselves. This provides users with a floorplan of their home, from which the rooms and areas can be selected for cleaning or restricted from access. The new robots accomplish ... » read more

Chip Industry Technical Paper Roundup: April 2


New technical papers recently added to Semiconductor Engineering’s library. [table id=211 /] Find last week’s technical paper additions here. » read more

Verifying Hardware CWEs in RTL Designs Generated by GenAI


A new technical paper titled "All Artificial, Less Intelligence: GenAI through the Lens of Formal Verification" was published by researchers at Infineon Technologies. Abstract "Modern hardware designs have grown increasingly efficient and complex. However, they are often susceptible to Common Weakness Enumerations (CWEs). This paper is focused on the formal verification of CWEs in a dataset... » read more

IoT Building Block: Touch Interface HMI


Many IoT devices have started to include touch screen interfaces as part of their UI to make the devices more intuitive and easier to use. A great interface can make customers really love and want to use your IoT product, but a poor HMI interface makes the device unusable damaging the brand value. Given this impact a touch interface can have on your IoT device, it made me wonder what are the... » read more

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