tag: Infineon

Chip Industry Week In Review
By The SE Staff - 10 Nov, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

Blog Review: Nov. 8
By Jesse Allen - 08 Nov, 2023 - Comments: 0

Siemens' Todd Westerhoff takes a look at the three stages of power integrity analysis for PCBs, challenges to board-level signal integrity, and best practices for getting the most accurate estimate of design performance. Synopsys' William Ruby provides a brief overview of the evolution of low-power design techniques and finds opportunities to reduce power and to make chip designs more energy... » read more

Understanding Memory Protection Units
By Ashwin Kumar - 06 Nov, 2023 - Comments: 0

Let’s talk about the various security measures we take to protect our homes. We use locks, install security cameras to detect any suspicious activities, etc., all to safeguard our loved ones and valuable possessions. In similar sense, the tiny microcontrollers inside our devices have protection units (PU) that safeguard the precious resource: memory. One of the most important types of prote... » read more

Chip Industry Week In Review
By The SE Staff - 03 Nov, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Bug, Flaw, Or Cyberattack?
By Ann Mutschler - 02 Nov, 2023 - Comments: 0

The lines between counterfeiting, security, and design flaws are becoming increasingly difficult to determine in advanced packages and process nodes, where the number of possible causes of unusual behavior grow exponentially with the complexity of a device. Strange behavior may be due to a counterfeit part, including one that contains a trojan. Or it may be the result of a cyberattack. It al... » read more

Usage Of Pulse-Edge Transformer In Secondary-Controlled Flyback Applications
By Infineon - 01 Nov, 2023 - Comments: 0

As the demand for smaller form factors and higher energy efficiency for charger/adapter grows, the wide bandgap (WBG) device technology is gaining popularity. To use the potential of WBG and thus improve the power density and efficiency, the switching frequency levels of converters are in the order of 300 kHz to 400 kHz. The higher switching frequency also requires faster control or response ti... » read more

Chip Industry Week In Review
By The SE Staff - 27 Oct, 2023 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan The Biden-Harris administration designated 31 Tech Hubs across the U.S. this week, focused on industries including autonomous systems, quantum computing, biotechnology, precision medicine, clean energy advancement, and semiconductor manufacturing. The Department of Commerce (DOC) also launched its second Tech Hubs Notice of Funding Opportunity. ... » read more

Chip Industry Week In Review
By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Blog Review: October 18
By Jesse Allen - 18 Oct, 2023 - Comments: 0

Siemens' Stephen Chavez suggests including analog mixed signal analysis and board level parasitics within the design process from the earliest electrical design stage and throughout final release of the PCB design. Synopsys’ Filip Thoen, Leonard Drucker, and Vivek Prasad highlight how the complexities and interdependencies of multi-die systems create new challenges for software bring-up, a... » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

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