The Week In Review: IoT


Security The Industrial Internet Consortium this week unveiled the Industrial Internet Security Framework, a set of specifications for connected health-care devices and hospitals, intelligent transportation, smart electrical grids, smart factories, and other cyber-physical systems in the Internet of Things. AT&T, Fujitsu, Hitachi, Infineon Technologies, Intel, Microsoft, and Symantec are among... » read more

Automotive Design Requires Rigor


Playing in the automotive space means a significant investment in terms of resources, and it brings other challenges as well, not to mention the specific engineering challenges of ADAS. According to Mike Stellfox, a Cadence Fellow, the challenges are adding up for current Tier 2 suppliers. “Mostly what we see is the same kinds of customers — at least in the Tier 2s — for the hardware ... » read more

The Week In Review: Design


IP Rambus debuted 3200 Mbps DDR4 PHY, targeted at the data center and networking markets, on the GlobalFoundries FX-14 ASIC platform using the company's 14nm Power Plus (LPP) process. The PHY is DFI 4.0 compatible, and supports 16 – 72-bit interfaces, along with single and multi-rank configurations. Synopsys introduced VIP and UVM source code test suite for Ethernet 200G, supporting 4x5... » read more

Analog Devices To Buy Linear Technology


Analog Devices has agreed to acquire Linear Technology for about $14.8 billion in cash and stock, creating an analog chip supplier that will rival Texas Instruments, STMicroelectronics, Infineon Technologies, and NXP Semiconductors in scope. The deal calls for Linear Technology shareholders to get $46 per share in cash and 0.2321 of a share in ADI common stock for their shares. The transa... » read more

RF GaN Gains Steam


The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

The Week In Review: Manufacturing


Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

The Week In Review: Manufacturing


Manufacturing United States President Barack Obama has announced the winner of the New Smart Manufacturing Innovation Institute and manufacturing hub competition. The winner is the Smart Manufacturing Leadership Coalition (SMLC). This coalition, headquartered in Los Angeles, Calif., brings together a consortium of nearly 200 partners from across academia, industry and non-profits. The idea is... » read more

The Week In Review: Manufacturing


Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

IC Industry Waking Up To Security


By Jeff Dorsch & Ed Sperling Many people pay lip service to the concept of security in Internet of Things devices, software, and networks. That oversight is beginning to fade away, however, as companies begin digging into one of the broadest and most complex problems in the IoT age. Unlike other technology issues, which have been solved in increments, security is all-inclusive. While ... » read more

The Mightier Microcontroller


Microcontrollers are becoming more complex, more powerful, and significantly more useful, but those improvements come with strings attached. While it's relatively straightforward to develop multi-core microcontroller (MCU) hardware with advanced power management features, it's much more difficult to write software for these chips because memory is limited. CPUs can use on-chip memory such as... » read more

← Older posts Newer posts →