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Startup Funding: Aug. 2022


Investors funneled $1.9 billion into startups last month. The total was down from the previous few months for companies tracked by Semiconductor Engineering, but still a strong showing for the chip industry and related technologies. By market segment, power devices were a bright spot in August's funding, with 12 companies receiving new financing rounds. A manufacturer of multilayer ceramic c... » read more

Startup Funding: August 2022 Sortable Funding Chart


Below is a sortable chart that accompanies your e-book purchase of Semiconductor Engineering's August 2022. Startup Funding report.  Simply click on the top headers to determine your primary sort. [table id=52 /] The complete ebook (over 40 pages) can be found here. » read more

Startup Funding: August 2022


Investors funneled $1.9 billion into startups last month. The total was down from the previous few months for companies tracked by Semiconductor Engineering, but still a strong showing for the chip industry and related technologies. By market segment, power devices were a bright spot in August's funding, with 12 companies receiving new financing rounds. A manufacturer of multilayer ceramic c... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Stellantis is buying Share Now, a car sharing service owned by BMW and Mercedes-Benz. Through the acquisition, Stellantis will be adding 3.4 million car sharing customers, 10,000 vehicles, and 14 new European cities to its Free2move car sharing service, which currently has 2 million users, 2,500 vehicles, and has 7 “mobility hubs” in the U.S. and Europe. ShareNow was a... » read more

Week In Review: Manufacturing, Test


Chipmakers, OEMs TSMC reported sales of $15.736 billion for the fourth quarter of 2021, up 5.7% sequentially. Net income grew 6.4% quarter-over-quarter. In the fourth quarter, shipments of 5nm accounted for 23% of total wafer revenues, while 7nm accounted for 27%. In the first quarter of 2022, TSMC’s sales are expected to be between $16.6 billion to $17.2 billion. TSMC also expects its 20... » read more

Angstrom-Level Measurements With AFMs


Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Manufacturing Bits: March 2


Next-gen AFM At the recent SPIE Advanced Lithography conference, Imec, Infinitesima and others described a new metrology tool technology called a Rapid Probe Microscope (RPM). Infinitesima has shipped its first RPM 3D system, enabling three-dimensional (3D) metrology applications for leading-edge chips. The system was jointly developed with Imec. In the IEDM paper, Imec and Infinitesima... » read more

Blog Review: Mar. 11


Rambus' Steven Woo examines how the upcoming deployment of 5G will enable processing at the edge, and how the edge is getting refined further into the near edge and the far edge with a range of AI solutions across it. A Synopsys writer explains the types of Compute Express Link devices and CXL's unique verification challenges like maintaining the cache coherency between a host CPU and an acc... » read more