tag: inspection

New Insights Into IC Process Defectivity
By Laura Peters - 07 Nov, 2023 - Comments: 1

Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be problematic at each new node, but now they are persistent problems at several nodes and in advanced packaging, where there may be a mix of different technologies. In addition, there are more proc... » read more

DRAM Test And Inspection Just Gets Tougher
By Anne Meixner - 07 Nov, 2023 - Comments: 0

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming much more difficult with the rollout of faster interfaces and multi-chip packages. DRAM plays a key role in a wide variety of electronic devices, from phones and PCs to ECUs in cars and servers ins... » read more

Isolating Critical Data In Failure Analysis
By Anne Meixner - 01 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss traceability and the lack of data needed to perform root cause analysis with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hakim, ASIC reliability engineer at Teradyne... » read more

5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success
By Jessica Albright - 21 Sep, 2023 - Comments: 0

Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent applications, such as pacemakers, defibrillators, life support systems, automotive safety systems, or in aviation need to be fail-proof. A device smaller than a centimeter with features just a few nanometers has no margin of error. This blog shares why it’s important to detect materia... » read more

Fab And Field Data Transforming Manufacturing Processes
By Gregory Haley - 12 Sep, 2023 - Comments: 0

The ability to capture, process, and analyze data in the field is transforming semiconductor metrology and testing, providing invaluable insight into a product's performance in real-time and under real-world conditions and use cases. Historically, data that encapsulates parameters such as power consumption, temperature, voltages, currents, timing, and other characteristics, was confined to d... » read more

SiC Growth For EVs Is Stressing Manufacturing
By Anne Meixner - 08 Aug, 2023 - Comments: 0

The electrification of vehicles is fueling demand for silicon carbide power ICs, but it also is creating challenges in finding and identifying defects in those chips. Coinciding with this is a growing awareness about just how immature SiC technology is and how much work still needs to be done — and how quickly that has to happen. Automakers are pushing heavily into electric vehicles, and t... » read more

Application For Non-Destructive Inspection
By Advantest - 08 Aug, 2023 - Comments: 0

IC chip internal measurement We attempted to apply the Hadatomo Z photoacoustic microscope for non-destructive inspection. One of the features of the HadatomoTM Z is simultaneous measurement using photoacoustic imaging and ultrasound imaging. By using an ultrasonic sensor with cen- ter frequency of 60 MHz, high-resolution imaging is possible. Photoacoustic imaging is a method to re... » read more

From Lab To Fab: Increasing Pressure To Fuse IC Processes
By Gregory Haley - 06 Jun, 2023 - Comments: 0

Test, metrology, and inspection are essential for both the lab and the fab, but fusing them together so that data created in one is easily transferred to the other is a massive challenge. The chip industry has been striving to bridge these separate worlds for years, but the economics, speed, and complexity of change require a new approach. The never-ending push toward smaller, better-defined... » read more

Ramping Up Power Electronics For EVs
By Anne Meixner - 06 Jun, 2023 - Comments: 0

The rapid acceleration of the power devices used in electric vehicles (EVs) is challenging chipmakers to adequately screen the ICs that power these vehicles.[1] While progress toward autonomous driving is grabbing the public’s attention, the electrification of transportation systems is progressing quietly. For the automotive industry, this shift involves a mix of electronic components. Amo... » read more

Challenges Grow For Creating Smaller Bumps For Flip Chips
By Anne Meixner - 18 May, 2023 - Comments: 0

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with high pin counts, flip-chip [1] packages have long been a popular choice because they utilize the whole die area for interconnect. The technology has been in use since the 1970s, starting with IBM�... » read more

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