tag: Intel

The Next Phase Of Machine Learning
By Kevin Fogarty - 09 Nov, 2017 - Comments: 0

Machine learning is all about doing complex calculations on huge volumes of data with increasing efficiency, and with a growing stockpile of success stories it has rapidly evolved from a rather obscure computer science concept into the go-to method for everything from facial recognition technology to autonomous cars. [getkc id="305" kc_name="Machine learning"] can apply to every corporate fu... » read more

Litho Options For Panel Fan-out
By Mark LaPedus - 06 Nov, 2017 - Comments: 2

Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Chiplets Gaining Steam
By Ann Mutschler - 06 Nov, 2017 - Comments: 0

Building chips from pre-verified chiplets is beginning to gain traction as a way of cutting costs and reducing time to market for heterogeneous designs. The chiplet concept has been on the drawing board for some time, but it has been viewed more as a possible future direction than a necessary solution. That perception is beginning to change as complexity rises, particularly at advanced nodes... » read more

Meanwhile, Back In Barcelona…
By Kyle Voosen - 06 Nov, 2017 - Comments: 0

We recently wrapped up another successful IoT Solutions World Congress (IoTSWC), hosted by the Industrial Internet Consortium (IIC) in Barcelona. We’ve been participating in the Congress since its inception three years ago, and this year was particularly exciting given the Catalonia Independence Referendum happening at the same time. Even with this as a backdrop, the event attracted 50 percen... » read more

The Week in Review: IoT
By Jeff Dorsch - 27 Oct, 2017 - Comments: 0

Finance Automile, an Internet of Things company involved in field-service businesses, has received $34 million in Series B funding led by Insight Venture Partners, bringing its total funding to $47 million. Existing investors Dawn Capital, Point Nine Capital, SaaStr Fund, and Salesforce Ventures also participated in the new round. Automile will use the money on marketing, product developmen... » read more

Blog Review: Oct. 25
By Jesse Allen - 25 Oct, 2017 - Comments: 0

Mentor's Joe Hupcey III explains the benefits of prioritizing faults with formal analysis before launching detailed fault verification. Cadence's Paul McLellan listens in as AMD's Mark Papermaster discusses what's needed to keep driving Moore's Law. Synopsys' Jesse Victors takes a look at ROCA, the latest flaw affecting RSA cryptography, and argues it may be time for a new encryption sche... » read more

Making high-capacity data caches more efficient
By Technical Paper Link - 24 Oct, 2017 - Comments: 4

Source: Researchers from MIT, Intel, and ETH Zurich Xiangyao Yu (MIT), Christopher J. Hughes (Intel), Nadathur Satish (Intel) Onur Mutlu (ETH Zurich), Srinivas Devadas (MIT) Technical Paper link MIT News article As the transistor counts in processors have gone up, the relatively slow connection between the processor and main memory has become the chief impediment to improving comp... » read more

Manufacturing Bits: Oct. 24
By Mark LaPedus - 24 Oct, 2017 - Comments: 0

Redefining unit measurements At a recent meeting, the International Committee for Weights and Measures (CIPM) took the next step towards the expected redefinition of four base units within the International System of Units (SI). The SI base units include the following metrics or constants--meter, kilogram, second, ampere, kelvin, mole, and the candela. Here’s the fundamental constant... » read more

System Bits: Oct. 24
By Ann Mutschler - 24 Oct, 2017 - Comments: 0

Optical communication on silicon chips With the huge increase in computing performance in recent decades achieved by squeezing ever more transistors into a tighter space on microchips, at the same time this downsizing has also meant packing the wiring within microprocessors ever more tightly together. This has led to effects such as signal leakage between components, which can slow down commun... » read more

Searching For EUV Mask Defects
By Mark LaPedus - 19 Oct, 2017 - Comments: 2

Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that is becoming more worrisome is how to find [gettech id="31045" comment="EUV"] mask defects. That isn't the only issue, of course. The industry continues to work on the power source and resists. Bu... » read more

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