tag: Intel

Hybrid Verification: The Only Way Forward
By Brian Bailey - 29 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="10" kc_name=" functional verification"]. The inability of RTL [getkc id="11" kc_name="simulation"] to keep up with verification needs is causing rapid change in the industry. Taking part in the discussion are Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Janick Bergeron, fe... » read more

Unraveling The Mysteries At IEDM
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

In some respects, the 2014 IEEE International Electron Devices Meeting (IEDM) was no different than past events. The event, held this week in San Francisco, included the usual and dizzying array of tutorials, sessions, papers and panels. On the leading-edge CMOS front, for example, the topics included [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D IC"] chips, III-V materials, [getkc ... » read more

Industry Scorecard For 2014
By Brian Bailey - 18 Dec, 2014 - Comments: 0

At the end of last year, Semiconductor Engineering asked the industry about the developments they expected to see in 2014. If you care to refresh your memory, they were categorized under markets, semiconductors and development tools. Now it is time to look back and see how accurate those predictions were and where they fell short. Markets The obvious trend, at the beginning of the year, wa... » read more

And the Winner is…
By Brian Bailey - 18 Dec, 2014 - Comments: 0

Semiconductor Engineering now has its first full year under its belt, and I have to say it has been an incredible year. Not only did we exceed a million page views in our first year, but we also got started on the Knowledge Center, an endeavor the likes of which has never been attempted in our industry. It is still very young and has a lot of growing up to do, but it is a wonderful start. We wo... » read more

Is The Stacked Die Ecosystem Stagnating?
By Ann Mutschler - 18 Dec, 2014 - Comments: 2

It is now widely agreed that not much has been happening in terms of adoption for 2.5D interposer and 3D ICs. “It seems like everyone is still at the starting line waiting for the race to begin," said Javier DeLaCruz, senior director of engineering of [getentity id="22242" e_name="eSilicon"]. "Interposer assembly and IP availability for effectively using the [getkc id="82" comment="2.5D IC... » read more

Software-Driven Verification (Part 1)
By Brian Bailey - 18 Dec, 2014 - Comments: 1

[getkc id="10" comment="Functional Verification"] has been powered by tools that require hardware to look like the kinds of systems that were being designed two decades ago. Those limitations are putting chips at risk and a new approach to the problem is long overdue. Semiconductor Engineering sat down with Frank Schirrmeister, group director, product marketing for System Development Suite at [... » read more

Manufacturing Bits: Dec. 16
By Mark LaPedus - 16 Dec, 2014 - Comments: 0

Space DSA NASA's Physical Science Research Program is taking directed self-assembly (DSA) technology to new heights. On the International Space Station, astronauts are exploring the development of nanoparticles suspended in magnetorheolocial (MR) fluids. MR fluids, which are a new class of smart materials, self-assemble into shapes in the presence of a magnetic field. With the technology, r... » read more

Hybrid Verification: The Only Way Forward
By Brian Bailey - 15 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="10" kc_name=" functional verification"]. The inability of RTL [getkc id="11" kc_name="simulation"] to keep up with verification needs is causing rapid change in the industry. Taking part in the discussion are Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Janick Bergeron, fe... » read more

IBM, Intel And TSMC Roll Out finFETs
By Mark LaPedus - 14 Dec, 2014 - Comments: 0

At the IEEE International Electron Devices Meeting (IEDM) in San Franciso, IBM, Intel and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) this week will separately present the latest details of their respective 16nm/14nm finFET technologies. As expected, Intel and TSMC will continue to use bulk CMOS. IBM will continue to go with rival silicon-on-insulator (SOI) technology. At IEDM, Intel ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Dec, 2014 - Comments: 0

Intel and Royal Caribbean International teamed up to integrate Intel-powered tablets onboard the Quantum of the Seas, the world’s first “smartship.” Royal Caribbean is installing 15,000 Intel-based Dell Venue tablets at point-of-sale locations on the new ship. When will Applied Materials’ proposed acquisition of Tokyo Electron Ltd. (TEL) happen? “Timing-wise we still think that it ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy